公开(公告)号：US11370942B2

公开(公告)日：2022-06-28

申请号：US16547344

申请日：2019-08-21

申请人： LG CHEM, LTD.

发明人： Yoon Gyung Cho ,  Hyun Jee Yoo ,  Kyung Yul Bae ,  Suk Ky Chang ,  Jung Sup Shim

IPC分类号： H01L51/54 ,  C09J7/10 ,  C09J123/20 ,  C08K3/34 ,  H01L51/00 ,  C09J11/02 ,  H01L51/52 ,  H01L51/56

摘要： The present invention relates to a pressure-sensitive adhesive composition and a pressure-sensitive adhesive film including the same, and provides a pressure-sensitive adhesive composition and a pressure-sensitive adhesive film which may prevent damage to an element from moisture contained in the composition, ionic substances, and other foreign substances, and effectively block electrochemical corrosion, thereby improving a lifetime and durability of an organic electronic device.

公开(公告)号：US10647890B2

公开(公告)日：2020-05-12

申请号：US15580193

申请日：2016-06-09

申请人： LG CHEM, LTD.

发明人： Kyung Yul Bae ,  Yoon Gyung Cho ,  Hyun Jee Yoo ,  Se Woo Yang

IPC分类号： C09J4/00 ,  C09J7/38 ,  C09J123/22 ,  H05K3/28 ,  C09J7/20 ,  C08G59/40 ,  C09J7/30 ,  C09J4/06 ,  H01L51/52 ,  H01L51/00 ,  C09J109/00 ,  C09J163/00 ,  H05K1/02 ,  H05K1/03 ,  C09J11/08

摘要： The present application relates to an adhesive composition comprising a curable oligomer and a polymer derived from butylene, an adhesive film comprising same, an organic electronic device comprising same, and a lighting apparatus and a display device comprising same. The adhesive film comprising the adhesive composition shows excellent moisture-blocking properties and enables an organic electronic device to have flexibility as well as excellent and reliable durability at high temperature and high humidity.

公开(公告)号：US10522786B2

公开(公告)日：2019-12-31

申请号：US16125244

申请日：2018-09-07

申请人： LG CHEM, LTD.

发明人： Hyun Jee Yoo ,  Seung Min Lee ,  Hyun Suk Kim ,  Suk Ky Chang ,  Jung Ok Moon

IPC分类号： H01L51/52 ,  H01L51/00 ,  H01L51/56

摘要： Provided are an organic electronic device (OED) and a method of manufacturing the same. The OED may effectively block moisture or oxygen permeating into the OED from an external environment, provide high reliability by increasing a life span and durability of an organic electronic diode, and minimize an align error in a process of attaching a film encapsulating the organic electronic diode to a substrate.

公开(公告)号：US20190382632A1

公开(公告)日：2019-12-19

申请号：US16547344

申请日：2019-08-21

申请人： LG CHEM, LTD.

发明人： Yoon Gyung CHO ,  Hyun Jee Yoo ,  Kyung Yul Bae ,  Suk Ky Chang ,  Jung Sup Shim

IPC分类号： C09J123/20 ,  C08K3/34 ,  H01L51/00

摘要： The present invention relates to a pressure-sensitive adhesive composition and a pressure-sensitive adhesive film including the same, and provides a pressure-sensitive adhesive composition and a pressure-sensitive adhesive film which may prevent damage to an element from moisture contained in the composition, ionic substances, and other foreign substances, and effectively block electrochemical corrosion, thereby improving a lifetime and durability of an organic electronic device.

公开(公告)号：US10227514B2

公开(公告)日：2019-03-12

申请号：US13899386

申请日：2013-05-21

申请人： LG CHEM, LTD.

发明人： Hyun Jee Yoo ,  Yoon Gyung Cho ,  Suk Ky Chang ,  Jung Sup Shim

IPC分类号： H05B33/10 ,  C09J163/00 ,  C09J9/00 ,  C09J11/04 ,  C09J7/10 ,  C09J133/08 ,  C08K3/013 ,  C08K3/22 ,  C08K3/36 ,  C08K3/34

摘要： The present invention relates to an adhesive composition, an adhesive film, a method of manufacturing the adhesive film and an organic electronic device (OED) that are used to encapsulate an organic electronic element. The adhesive composition can form an encapsulant layer having an excellent adhesive property, impact resistance, heat-protecting property and moisture blocking property, so that an OED that includes an element encapsulated with the adhesive composition can exhibit an excellent lifespan property and durability.

公开(公告)号：US10141543B2

公开(公告)日：2018-11-27

申请号：US14323827

申请日：2014-07-03

申请人： LG CHEM, LTD.

发明人： Yoon Gyung Cho ,  Hyun Jee Yoo ,  Suk Ky Chang ,  Jung Sup Shim ,  Seung Min Lee

IPC分类号： B32B37/00 ,  H01L51/52 ,  H01L23/29 ,  H01L21/56 ,  B32B27/08 ,  B32B27/18 ,  H05B33/04 ,  B32B43/00 ,  H01L51/56 ,  B32B37/14 ,  C09D123/22 ,  C09D163/00 ,  B32B3/04 ,  B32B37/10 ,  B32B37/12 ,  B32B37/24

摘要： Provided is a method of manufacturing an electronic device. An electronic device having excellent moisture blocking property and durability may be provided by the method.

公开(公告)号：US10062855B2

公开(公告)日：2018-08-28

申请号：US14740006

申请日：2015-06-15

申请人： LG CHEM, LTD.

发明人： Hyun Jee Yoo ,  Yoon Gyung Cho ,  Suk Ky Chang ,  Jung Sup Shim ,  Suk Chin Lee ,  Kwang Jin Jeong

IPC分类号： H01L33/00 ,  H01L29/08 ,  H01L51/00 ,  H01L21/00 ,  H01L51/52 ,  H05B33/04 ,  H01L51/56 ,  C09J7/00 ,  C09J163/00 ,  H01L21/56 ,  H01L23/28 ,  H01L23/29 ,  H01L23/00 ,  C09J9/00 ,  C09J11/04 ,  C09J7/35 ,  C09J7/10 ,  C08K3/22 ,  C08K3/34 ,  C08K3/36 ,  C08K3/16

CPC分类号： H01L51/0094 ,  C08K3/16 ,  C08K3/22 ,  C08K3/346 ,  C08K3/36 ,  C08K2003/162 ,  C08K2003/166 ,  C08K2003/2206 ,  C09J7/00 ,  C09J7/10 ,  C09J7/35 ,  C09J9/00 ,  C09J11/04 ,  C09J163/00 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  H01L21/56 ,  H01L23/28 ,  H01L23/295 ,  H01L23/564 ,  H01L51/0034 ,  H01L51/0035 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/5256 ,  H01L51/5259 ,  H01L51/56 ,  H01L2251/301 ,  H01L2251/303 ,  H01L2924/0002 ,  H05B33/04 ,  H01L2924/00

摘要： An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.

公开(公告)号：US09768386B2

公开(公告)日：2017-09-19

申请号：US14899978

申请日：2014-06-18

申请人： LG CHEM, LTD.

发明人： Jung Sup Shim ,  Yoon Gyung Cho ,  Suk Ky Chang ,  Hyun Jee Yoo ,  Seung Min Lee ,  Kyung Yul Bae

IPC分类号： C08J5/18 ,  C08L23/22 ,  H01L51/00 ,  H01L51/52 ,  C08L101/02 ,  H01L23/29

CPC分类号： H01L51/004 ,  C08J5/18 ,  C08J2323/22 ,  C08J2423/30 ,  C08L23/22 ,  C08L101/02 ,  C08L2203/206 ,  C08L2205/02 ,  C08L2205/08 ,  H01L23/293 ,  H01L51/0043 ,  H01L51/5253 ,  H01L51/5259 ,  H01L2924/0002 ,  H01L2924/00

摘要： There are provided a composition for encapsulation film, an encapsulation film, and an electronic device having the same. The present application may provide an encapsulation film having an excellent moisture barrier property, operability, workability, and durability and a structure including an element encapsulated by the encapsulation film.

公开(公告)号：US09698378B2

公开(公告)日：2017-07-04

申请号：US14323703

申请日：2014-07-03

申请人： LG CHEM, LTD.

发明人： Yoon Gyung Cho ,  Hyun Jee Yoo ,  Suk Ky Chang ,  Jung Sup Shim ,  Seung Min Lee

IPC分类号： B32B27/08 ,  H01L51/52 ,  H01L51/56 ,  B32B27/18 ,  H01L23/29 ,  H01L21/56 ,  H05B33/04 ,  B32B43/00 ,  B32B37/14 ,  C09D123/22 ,  C09D163/00 ,  B32B3/04 ,  B32B37/10 ,  B32B37/12 ,  B32B37/24

CPC分类号： H01L51/5259 ,  B32B3/04 ,  B32B27/08 ,  B32B27/18 ,  B32B37/10 ,  B32B37/142 ,  B32B43/00 ,  B32B2037/1223 ,  B32B2037/243 ,  B32B2307/54 ,  B32B2307/7265 ,  B32B2309/02 ,  B32B2309/04 ,  B32B2309/10 ,  B32B2309/105 ,  B32B2310/0831 ,  B32B2315/08 ,  B32B2457/00 ,  B32B2457/20 ,  B32B2457/206 ,  C09D123/22 ,  C09D163/00 ,  H01L21/56 ,  H01L23/293 ,  H01L51/524 ,  H01L51/5253 ,  H01L51/56 ,  H01L2924/0002 ,  H05B33/04 ,  Y10T156/10 ,  Y10T428/24942 ,  Y10T428/31511 ,  Y10T428/31931 ,  Y10T428/31938 ,  H01L2924/00

摘要： Provided are an encapsulating film, an electronic device and a method of manufacturing the same. An encapsulating film having excellent moisture blocking property, handleability, workability and durability and a structure including a diode encapsulated with the encapsulating film may be provided.

公开(公告)号：US09577214B2

公开(公告)日：2017-02-21

申请号：US14098347

申请日：2013-12-05

申请人： LG CHEM, LTD.

发明人： Hyun Jee Yoo ,  Yoon Gyung Cho ,  Seung Min Lee ,  Suk Ky Chang ,  Jung Sup Shim

IPC分类号： C09J7/02 ,  C09J7/00 ,  C09J11/00 ,  C08K3/22 ,  C08K3/24 ,  C08K3/32 ,  H01L51/52 ,  C08K3/00

CPC分类号： H01L51/5246 ,  C08K3/013 ,  C08K3/22 ,  C08K3/24 ,  C08K3/32 ,  C08K2003/2227 ,  C09J7/00 ,  C09J7/10 ,  C09J7/35 ,  C09J11/00 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  H01L51/524 ,  H01L51/5253 ,  H01L51/5259 ,  Y10T428/24942 ,  Y10T428/24959

摘要： Provided are an adhesive film, an encapsulated product of an organic electronic device using the same, and a method of encapsulating an organic electronic device. Particularly, the adhesive film encapsulating the organic electronic device to cover an entire surface of the organic electronic device includes an adhesive layer including a curable resin and a moisture adsorbent. The adhesive layer has a viscosity in a temperature range of 30 to 130° C. of 101 to 106 Pa·s and a viscosity at room temperature of 106 Pa·s or more in an uncured state, and when the adhesive layer has a multilayered structure, a difference in melting viscosity between layers is less than 30 Pa·s. In addition, the method of encapsulating an organic electronic device using the adhesive film is provided.

摘要翻译： 提供一种粘合膜，使用其的有机电子器件的封装产品，以及封装有机电子器件的方法。 特别地，封装有机电子器件以覆盖有机电子器件的整个表面的粘合剂膜包括具有可固化树脂和水分吸附剂的粘合剂层。 粘合剂层在未固化状态下的粘度在30〜130℃的温度范围为101〜106Pa·s，室温下的粘度为106Pa·s以上，并且当粘合剂层具有多层 结构上，层间的熔融粘度差小于30Pa·s。 此外，提供了使用粘合膜封装有机电子器件的方法。