A vacuum socket includes a lower housing including a concave portion with a first hole, the concave portion having a recessed cross section and a printed circuit board in the concave portion, wherein the printed circuit board includes a second hole coupled to the first hole and pads provided along an edge region thereof, a cover provided in the concave portion to cover the printed circuit board, and a vacuum pad inserted in the first hole, the vacuum pad having a third hole coupled to the second hole, wherein the printed circuit board is electrically connected to a first semiconductor chip loaded between the printed circuit board and the cover, via the pads.