Vacuum socket and semiconductor testing system including the same

    公开(公告)号:US09958500B2

    公开(公告)日:2018-05-01

    申请号:US15187158

    申请日:2016-06-20

    CPC classification number: G01R31/2893 G01R1/0466

    Abstract: A vacuum socket includes a lower housing including a concave portion with a first hole, the concave portion having a recessed cross section and a printed circuit board in the concave portion, wherein the printed circuit board includes a second hole coupled to the first hole and pads provided along an edge region thereof, a cover provided in the concave portion to cover the printed circuit board, and a vacuum pad inserted in the first hole, the vacuum pad having a third hole coupled to the second hole, wherein the printed circuit board is electrically connected to a first semiconductor chip loaded between the printed circuit board and the cover, via the pads.

    VACUUM SOCKET AND SEMICONDUCTOR TESTING SYSTEM INCLUDING THE SAME
    2.
    发明申请
    VACUUM SOCKET AND SEMICONDUCTOR TESTING SYSTEM INCLUDING THE SAME 有权
    真空插座和半导体测试系统,包括它们

    公开(公告)号:US20170010324A1

    公开(公告)日:2017-01-12

    申请号:US15187158

    申请日:2016-06-20

    CPC classification number: G01R31/2893 G01R1/0466

    Abstract: A vacuum socket includes a lower housing including a concave portion with a first hole, the concave portion having a recessed cross section and a printed circuit board in the concave portion, wherein the printed circuit board includes a second hole coupled to the first hole and pads provided along an edge region thereof, a cover provided in the concave portion to cover the printed circuit board, and a vacuum pad inserted in the first hole, the vacuum pad having a third hole coupled to the second hole, wherein the printed circuit board is electrically connected to a first semiconductor chip loaded between the printed circuit board and the cover, via the pads.

    Abstract translation: 真空插座包括:下壳体,包括具有第一孔的凹部,所述凹部具有凹入的横截面,以及在所述凹部中的印刷电路板,其中所述印刷电路板包括耦合到所述第一孔的第二孔和焊盘 沿其边缘区域设置有设置在所述凹部中以覆盖所述印刷电路板的盖和插入所述第一孔中的真空垫,所述真空垫具有联接到所述第二孔的第三孔,其中所述印刷电路板是 经由焊盘电连接到装载在印刷电路板和盖之间的第一半导体芯片。

Patent Agency Ranking