Invention Grant
- Patent Title: Honeycomb heaters for integrated circuit manufacturing
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Application No.: US13436263Application Date: 2012-03-30
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Publication No.: US09960059B2Publication Date: 2018-05-01
- Inventor: Yi-Hung Lin , Jr-Hung Li , Chii-Horng Li , Tze-Liang Lee
- Applicant: Yi-Hung Lin , Jr-Hung Li , Chii-Horng Li , Tze-Liang Lee
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H05B3/06
- IPC: H05B3/06 ; H01L21/67 ; H05B3/00

Abstract:
A honeycomb heater includes a lamp housing having an outer edge that forms a partial circle. The lamp housing has an opening extending from a top surface to a bottom surface of the lamp housing. The opening further extends from the outer edge into a center region of the lamp housing. A plurality of lamps is distributed throughout the lamp housing, and is configured to emit light out of the top surface of the lamp housing.
Public/Granted literature
- US20130256292A1 Honey Cone Heaters for Integrated Circuit Manufacturing Public/Granted day:2013-10-03
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