Invention Grant
- Patent Title: Fluid feed slot for fluid ejection device
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Application No.: US14766925Application Date: 2013-02-13
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Publication No.: US09962938B2Publication Date: 2018-05-08
- Inventor: Ed Friesen , Rio Rivas , Kelly Ronk
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: Dicke, Billig & Czaja, PLLC
- International Application: PCT/US2013/025931 WO 20130213
- International Announcement: WO2014/126559 WO 20140821
- Main IPC: B41J2/16
- IPC: B41J2/16 ; B41J2/175 ; B41J29/393 ; B23K26/382 ; B23K26/402 ; B41J2/14 ; B23K103/00 ; B23K103/08 ; B23K103/10 ; B23K103/12 ; B23K103/14

Abstract:
A method of forming a substrate for a fluid ejection device includes forming an opening in the substrate from a second side toward a first side, and further forming the opening in the substrate to the first side, including increasing the opening to the first side and increasing the opening at the second side, and forming the opening with substantially parallel sidewalls intermediate the first side and the second side and converging sidewalls to the first side.
Public/Granted literature
- US20160031216A1 FLUID EJECTION DEVICE Public/Granted day:2016-02-04
Information query
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