公开(公告)号：US20250018489A1

公开(公告)日：2025-01-16

申请号：US18899793

申请日：2024-09-27

Applicant: ABB Schweiz AG

Inventor： Christoph Kenel ,  Markus Hoidis

IPC: B23K1/19 ,  B23K103/00 ,  B23K103/12

Abstract: A brazing method for providing a brazed joint. The method comprises directly brazing an AgC contact to a Cu carrier using an active braze.

公开(公告)号：US20240391009A1

公开(公告)日：2024-11-28

申请号：US18694422

申请日：2022-03-23

Applicant: SHANGHAI JIAO TONG UNIVERSITY

Inventor： Zhen HUANG

IPC: B23K1/20 ,  B23K1/00 ,  B23K101/38 ,  B23K103/12

Abstract: A solder-free joint and a welding method thereof are provided. The welding method includes the following steps: S1: uniformly coating a flux on a surface of each of a plurality of materials to be soldered, thereby forming a flux layer; S2: performing binding according to the surface of the material, the flux layer, and the surface of the material; and S3: putting the materials into a hot-pressing device, and setting a desired pressure and temperature for soldering. In pretreatment before soldering, the welding method does not add any solder. The obtained solder-free joint has a desirable conductivity and desirable mechanical properties.

公开(公告)号：US20240316689A1

公开(公告)日：2024-09-26

申请号：US18580395

申请日：2022-07-26

Applicant: OSAKA UNIVERSITY

Inventor： Hidetoshi FUJII ,  Huihong LIU ,  Yoshiaki MORISADA

IPC: B23K20/12 ,  B23K103/04 ,  B23K103/10 ,  B23K103/12

CPC classification number: B23K20/129 ,  B23K2103/04 ,  B23K2103/10 ,  B23K2103/12

Abstract: Provided are: a solid-state joining method with which it is possible to control the discharge direction of burrs and to realize sufficient joining strength; a solid-state joined joint and a solid-state joined structure that are obtained through the solid-state joining method; and a solid-state joining device that can be suitably used in the solid-state joining method. A solid-state joining method characterized by having a first step for bringing end parts of one material being joined and another material being joined into butting contact with one another and forming a joining interface, a second step for increasing the temperature in the vicinity of the joining interface by using an external heating means, and a third step for plastically deforming the joining interface to thereby discharge burrs and form a solid-state joined interface, the plate thickness of the end part of the one material being joined and/or the other material being joined is reduced, and the solid-state joining method having a gradient such that the plate thickness decreases on a side where discharge of the burrs is suppressed.

公开(公告)号：US12036628B2

公开(公告)日：2024-07-16

申请号：US18140662

申请日：2023-04-28

Applicant: Aptiv Technologies AG

Inventor： Stephen Antaya ,  William Falk ,  Justin Amalfitano ,  Amit Datta

IPC: B23K35/26 ,  B23K103/00 ,  B23K103/02 ,  B23K103/12 ,  C22C13/00 ,  C22C30/04 ,  C22C30/06

CPC classification number: B23K35/262 ,  C22C13/00 ,  C22C30/04 ,  C22C30/06 ,  B23K2103/02 ,  B23K2103/12 ,  B23K2103/54 ,  Y10T428/12597 ,  Y10T428/12715 ,  Y10T428/12722

Abstract: An electrical connector includes a first layer formed of a copper based material and a second layer formed of an iron-nickel alloy. The second layer has a thickness of 8% to 30% of the thickness of the electrical connector. The electrical connector also includes a third layer which is formed of a solder alloy that consists essentially of 17% to 28% indium by weight, 12% to 20% zinc by weight, 1% to 6% silver by weight, 1% to 3% copper by weight, and a remaining weight of the solder alloy that is tin.

公开(公告)号：US12023754B2

公开(公告)日：2024-07-02

申请号：US18255401

申请日：2021-11-16

Applicant: Auto-Kabel Management GmbH

Inventor： Urszula Bitner ,  Marie Redder ,  Kabelo Sebetlela

IPC: B23K26/0622 ,  B23K26/00 ,  B23K26/34 ,  B23K26/38 ,  B23K101/36 ,  B23K103/10 ,  B23K103/12

CPC classification number: B23K26/0624 ,  B23K26/0006 ,  B23K26/34 ,  B23K26/38 ,  B23K2101/36 ,  B23K2103/10 ,  B23K2103/12

Abstract: A method of coating metal parts, comprising providing a metal part of a first metal material, applying a foil of a second metal material to the metal material onto the metal part in a bearing area, and irradiating the foil applied on the metal part in at least part of the bearing area with a laser.

公开(公告)号：US11980967B2

公开(公告)日：2024-05-14

申请号：US16400792

申请日：2019-05-01

Applicant: Electro Scientific Industries, Inc.

Inventor： Yunlong Sun

IPC: B23K26/06 ,  B23K26/0622 ,  B23K26/40 ,  B23K103/00 ,  B23K103/10 ,  B23K103/12 ,  B23K103/16

CPC classification number: B23K26/0624 ,  B23K26/0622 ,  B23K26/40 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/172 ,  B23K2103/30 ,  B23K2103/42 ,  B23K2103/50 ,  B23K2103/52

Abstract: A series of laser pulse bundles or bursts are used for micromachining target structures. Each burst includes short laser pulses with temporal pulse widths that are less than approximately 1 nanosecond. A laser micromachining method includes generating a burst of laser pulses and adjusting an envelope of the burst of laser pulses for processing target locations. The method includes adjusting the burst envelope by selectively adjusting one or more first laser pulses within the burst to a first amplitude based on processing characteristics of a first feature at a target location, and selectively adjusting one or more second laser pulses within the burst to a second amplitude based on processing characteristics of a second feature at the target location. The method further includes directing the amplitude adjusted burst of laser pulses to the target location.

公开(公告)号：US11942748B2

公开(公告)日：2024-03-26

申请号：US16979676

申请日：2018-12-14

Applicant: Auto-Kabel Management GmbH

Inventor： Rene Mathews ,  Kai Moldenhauer

IPC: H01R43/28 ,  B23K20/10 ,  B23K20/227 ,  B23K20/233 ,  H01R11/26 ,  H01R11/28 ,  B23K101/00 ,  B23K101/32 ,  B23K101/38 ,  B23K103/04 ,  B23K103/10 ,  B23K103/12 ,  B23K103/20 ,  H01R4/02 ,  H01R43/02

CPC classification number: H01R43/28 ,  B23K20/106 ,  B23K20/2275 ,  B23K20/2333 ,  B23K20/2336 ,  H01R11/26 ,  H01R11/281 ,  B23K2101/006 ,  B23K2101/32 ,  B23K2101/38 ,  B23K2103/05 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/20 ,  H01R4/029 ,  H01R43/0207 ,  H01R43/0214

Abstract: Method for establishing a connection between an electrical connecting element for a motor vehicle on-board network and a cable of the motor vehicle on-board network in which the cable (2) is provided with a metallic stranded conductor (4), firstly the metallic stranded conductor is mechanically compacted in such a way that a flat area is formed, whereby during the compacting, a material bond is formed between strands of the stranded conductor (4), and subsequently, the connecting element is connected to the flat region in a material bond.

公开(公告)号：US11936152B2

公开(公告)日：2024-03-19

申请号：US16937082

申请日：2020-07-23

Applicant: NEXANS

Inventor： Helmut Steinberg

IPC: H01R4/02 ,  B23K20/12 ,  H01R43/02 ,  B23K101/38 ,  B23K103/10 ,  B23K103/12 ,  H01R4/58

CPC classification number: H01R43/02 ,  B23K20/122 ,  H01R4/029 ,  B23K2101/38 ,  B23K2103/10 ,  B23K2103/12 ,  H01R4/58

Abstract: A method is provided for electrically conductively connecting a contact part to a conductor having a multiplicity of individual wires includes inserting the conductor into a cavity in the contact part and lowering a tool for friction stir welding onto the contact part. The tool for friction stir welding is moved on the contact part in a plane, thus giving rise to a planar cohesive connection between the contact part and the conductor. In this way, a direct cohesive connection of a stranded conductor and a contact part is produced without the need for an additional part such as a sleeve, for example, to prevent the stranded conductor from “sticking out”.

公开(公告)号：US11897050B1

公开(公告)日：2024-02-13

申请号：US17971512

申请日：2022-10-21

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Taizo Tomioka

IPC: B23K20/00 ,  B23K20/12 ,  B23K103/04 ,  B23K103/20 ,  B23K103/12 ,  B23K103/08 ,  B23K103/10

CPC classification number: B23K20/125 ,  B23K2103/04 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/15 ,  B23K2103/20

Abstract: A method for joining dissimilar metals according to the embodiment is a method for butt-joining, using frictional heat, a first member having a plate shape and containing first metal and a second member having a plate shape and containing second metal having a melting point higher than that of the first metal. The method for joining dissimilar metals includes: overlapping an end portion of the second member on an end portion of the first member; and pressurizing the second member toward the first member by bringing a rotating joining tool having a protruding portion at a tip end into contact with an overlapping portion of the second member with the first member. When the second member is pressurized toward the first member, the tip end of the rotating joining tool is not in contact with the first member.

公开(公告)号：US11823920B2

公开(公告)日：2023-11-21

申请号：US17124475

申请日：2020-12-16

Applicant: JMJ Korea Co., Ltd.

Inventor： Yun Hwa Choi ,  Jung Min Park

IPC: H01L21/67 ,  B22F7/06 ,  B23K1/00 ,  B23K1/005 ,  B23K1/012 ,  B23K3/06 ,  B23K37/04 ,  H01L21/673 ,  H01L21/677 ,  H01L21/68 ,  B23K103/12 ,  B23K101/40

CPC classification number: H01L21/67144 ,  B22F7/064 ,  B23K1/0016 ,  B23K1/0056 ,  B23K1/012 ,  B23K3/0607 ,  B23K37/04 ,  H01L21/67034 ,  H01L21/67333 ,  H01L21/67754 ,  H01L21/681 ,  B22F2301/10 ,  B22F2301/255 ,  B23K2101/40 ,  B23K2103/12

Abstract: Provided is an apparatus for attaching semiconductor parts. The apparatus includes a substrate loading unit, at least one semiconductor part loader, a first vision examination unit, at least one semiconductor part picker, at least one adhesive hardening unit, and a substrate unloading unit, wherein the substrate loading unit supplies a substrate on which semiconductor units are arranged, the at least one semiconductor part loader supplies semiconductor parts, the first vision examination unit examines arrangement states of the semiconductor units, the at least one semiconductor part picker mounts semiconductor parts in the semiconductor units, the at least one adhesive hardening unit hardens and attaches adhesives interposed between the semiconductor units and the semiconductor parts, and the substrate unloading unit releases the substrate on which semiconductor parts are mounted. The adhesive hardening units restrictively transmit a heat source only to at least one semiconductor unit, which is to be hardened.