Invention Grant
- Patent Title: Multilayer electronic component
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Application No.: US15265449Application Date: 2016-09-14
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Publication No.: US09966191B2Publication Date: 2018-05-08
- Inventor: Yohei Noda , Hirobumi Tanaka , Keisuke Okai
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2015-182055 20150915
- Main IPC: H01G4/30
- IPC: H01G4/30 ; C03C3/085 ; C03C3/062 ; C03C3/091 ; C03C3/087 ; C03C3/064 ; C03C4/16 ; C03C3/089 ; C03C10/00 ; H01G4/224 ; H01G4/232 ; H01G4/12

Abstract:
A multilayer electronic component includes an element body having an internal electrode layer and a dielectric layer. These are substantially parallel to a plane including a first axis and a second axis and are alternately laminated along a third axis direction. Side surfaces facing each other in the first axis direction are respectively equipped with an insulating layer. End surfaces facing each other in the second axis direction are respectively equipped with an external electrode. The insulating layer includes a glass component. A formula (1) of 0.25
Public/Granted literature
- US20170076868A1 MULTILAYER ELECTRONIC COMPONENT Public/Granted day:2017-03-16
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