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    Multilayer electronic component
    1.
    发明授权
    Multilayer electronic component 有权

    公开(公告)号：US09991054B2

    公开(公告)日：2018-06-05

    申请号：US15265206

    申请日：2016-09-14

    Applicant: TDK CORPORATION

    Inventor： Keisuke Okai ,  Hirobumi Tanaka ,  Yohei Noda

    IPC: H01G4/30 ,  H01G4/232 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12

    CPC classification number: H01G4/30 ,  H01G4/0085 ,  H01G4/012 ,  H01G4/1227 ,  H01G4/232

    Abstract: A multilayer electronic component includes an element body having an internal electrode layer and a dielectric layer. These are substantially parallel to a plane including a first axis and a second axis and are alternately laminated along a third axis direction. Side surfaces oppositely facing in the first axis direction are respectively equipped with an insulating layer. End surfaces facing each other in the second axis direction are respectively equipped with an external electrode. An end portion in the first axis direction of the internal electrode layer is recessed from an end portion in the first axis direction of the dielectric layer to the inner side along the first axis direction. A main component of the internal electrode layer is Ni. A reaction portion is between the end portion in the first axis direction of the internal electrode layer and the insulating layer.

    Multilayer electronic component
    2.
    发明授权
    Multilayer electronic component 有权

    公开(公告)号：US09865397B2

    公开(公告)日：2018-01-09

    申请号：US15264939

    申请日：2016-09-14

    Applicant: TDK CORPORATION

    Inventor： Hirobumi Tanaka ,  Yohei Noda ,  Keisuke Okai ,  Makoto Endo

    IPC: H01G4/30 ,  H01G4/232 ,  H01G4/224 ,  H01G4/12

    CPC classification number: H01G4/30 ,  H01G4/12 ,  H01G4/224 ,  H01G4/232 ,  H01G4/2325

    Abstract: A multilayer electronic component includes an element body having an internal electrode layer and a dielectric layer. These are substantially parallel to a plane including a first axis and a second axis and are alternately laminated along a third axis direction. Side surfaces facing each other in the first axis direction are respectively equipped with an insulating layer. End surfaces facing each other in the second axis direction are respectively equipped with an external electrode. A main component of the insulating layer is constituted by glass containing Si at 25 wt % or more. The external electrode includes glass containing at least Si. The external electrode covers an end portion in the second axial direction of the insulating layer. A diffusing layer is partially present at least at a bonding portion of the insulating layer with the external electrode in the side surface.

    Multi-layer ceramic electronic device
    7.
    发明授权
    Multi-layer ceramic electronic device 有权

    公开(公告)号：US11476049B2

    公开(公告)日：2022-10-18

    申请号：US16668050

    申请日：2019-10-30

    Applicant: TDK CORPORATION

    Inventor： Toshio Sakurai ,  Hirobumi Tanaka ,  Keisuke Okai ,  Daisuke Iwanaga ,  Hisashi Nakata ,  Tomoya Shibasaki

    IPC: H01G4/224 ,  H01G4/30 ,  H01G4/232 ,  H01G4/248 ,  H01G4/012 ,  H01G4/12

    Abstract: A multi-layer ceramic electronic device includes an element body and terminal electrodes. The terminal electrodes include end electrode parts covering ends of the element body in which internal electrode layers are led and upper electrode parts continuing to the end electrode parts and each partially covering an upper surface of the element body in a lamination direction. An upper-surface cover layer covering the upper surface of the element body located between the upper electrode parts has an external surface substantially flush with external surfaces of the upper electrode parts. The terminal electrodes are not substantially formed on a lower surface of the element body located opposite to the upper surface of the element body in the lamination direction.

    Multilayer electronic component
    8.
    发明授权
    Multilayer electronic component 有权

    公开(公告)号：US09997297B2

    公开(公告)日：2018-06-12

    申请号：US15264962

    申请日：2016-09-14

    Applicant: TDK CORPORATION

    Inventor： Keisuke Okai ,  Hirobumi Tanaka

    IPC: H01G4/30 ,  H01G4/005 ,  H01G4/228 ,  H01G5/16 ,  H01G5/013 ,  H01G5/011

    CPC classification number: H01G5/16 ,  H01G4/005 ,  H01G4/0085 ,  H01G4/012 ,  H01G4/12 ,  H01G4/228 ,  H01G4/232 ,  H01G4/30 ,  H01G5/011 ,  H01G5/0134

    Abstract: A multilayer electronic component includes an element body having internal electrode layers and dielectric layers. These are substantially parallel to a plane including a first axis and a second axis and are alternately laminated along a third axis direction. Side surfaces oppositely facing in the first axis direction are respectively equipped with an insulating layer. End surfaces facing each other in the second axis direction are respectively equipped with an external electrode. End portions in the first axis direction of the internal electrode layers are recessed from end portions in the first axis direction of the dielectric layers to an inner side along the first axis direction. The retraction distances are varied at a predetermined range in each layer of the internal electrode layers.

    Multilayer ceramic electronic component
    10.
    发明授权
    Multilayer ceramic electronic component 有权

    公开(公告)号：US11107632B2

    公开(公告)日：2021-08-31

    申请号：US16520741

    申请日：2019-07-24

    Applicant: TDK CORPORATION

    Inventor： Toshio Sakurai ,  Hirobumi Tanaka ,  Keisuke Okai ,  Daisuke Iwanaga ,  Hisashi Nakata ,  Tomoya Sihbasaki

    IPC: H01G4/232 ,  H01G4/30 ,  H01G4/258

    Abstract: A multilayer ceramic electronic component includes an element body and a terminal electrode. The element body includes internal electrode layers and insulation layers alternately laminated in a lamination direction. The terminal electrode is formed on an outer surface of the element body to be contacted and connected with the internal electrode layers. The terminal electrode includes an end-side electrode part and an upper-side electrode part. The end-side electrode part covers a leading end of the element body where the internal electrode layers are led. The upper-side electrode part is formed on a part of an upper surface of the element body and continues to the end-side electrode part. The terminal electrode is not substantially formed on a lower surface of the element body located on the other side of the upper surface along the lamination direction.

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