- 专利标题: Semiconductor device and semiconductor package comprising the same
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申请号: US15298919申请日: 2016-10-20
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公开(公告)号: US09966317B2公开(公告)日: 2018-05-08
- 发明人: Joung-Yeal Kim , Dae-Hyun Kwon , Mi-Young Woo , Joon-Sun Yoon , Jong-Hyun Choi
- 申请人: Joung-Yeal Kim , Dae-Hyun Kwon , Mi-Young Woo , Joon-Sun Yoon , Jong-Hyun Choi
- 申请人地址: KR Gyeonggi-do
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Gyeonggi-do
- 代理机构: Harness, Dickey & Pierce, P.L.C.
- 优先权: KR10-2015-0146546 20151021
- 主分类号: H01L21/66
- IPC分类号: H01L21/66 ; H01L23/498 ; H01L49/02 ; H01L27/08
摘要:
A semiconductor device may include a first terminal electrically connected to a first semiconductor chip, a second terminal electrically connected to a second semiconductor chip, which is different from the first semiconductor chip, a first signal line electrically connecting the first terminal and the second terminal and including a first node, a third terminal connected to a tester monitoring a signal transmitted between the first semiconductor chip and the second semiconductor chip, a fourth terminal applied a reference voltage, a second signal line electrically connecting the third terminal and the fourth terminal and including a second node, a first resistor connected between the first node and the second node and a second resistor directly connected to the second node different from the first resistor.
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