Invention Grant
- Patent Title: Cooling device and electronic device
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Application No.: US15110888Application Date: 2015-01-15
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Publication No.: US09968003B2Publication Date: 2018-05-08
- Inventor: Hitoshi Sakamoto , Minoru Yoshikawa , Mahiro Hachiya
- Applicant: NEC Corporation
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Wilmer Cutler Pickering Hale and Dorr LLP
- Priority: JP2014-005775 20140116
- International Application: PCT/JP2015/000163 WO 20150115
- International Announcement: WO2015/107899 WO 20150723
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/427 ; H01L23/467 ; F28D15/02

Abstract:
A cooling device 100 includes a first heat receiving unit 400, a second heat receiving unit 410, a first heat dissipating unit 700, and a second heat dissipating unit 710. The first heat dissipating unit 700 and the second heat dissipating unit 710 have a flat plate shape and have a structure in which air passes in a direction approximately perpendicular to a principal surface having a flat plate shape and a first principal surface 730 that is a principal surface having a flat plate shape in the first heat dissipating unit 700 and a second principal surface 740 that is a principal surface having a flat plate shape in the second heat dissipating unit 710 are arranged so as to face to each other. As a result, the size of the cooling device 100 can be reduced without degrading a heat dissipation performance to dissipate heat generated by a heat generating element.
Public/Granted literature
- US20160338226A1 COOLING DEVICE AND ELECTRONIC DEVICE Public/Granted day:2016-11-17
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