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    Phase-change cooler and phase-change cooling method
    1.
    发明授权
    Phase-change cooler and phase-change cooling method 有权

    公开(公告)号：US10607918B2

    公开(公告)日：2020-03-31

    申请号：US15128354

    申请日：2015-03-20

    Applicant: NEC Corporation

    Inventor： Hitoshi Sakamoto ,  Minoru Yoshikawa ,  Mahiro Hachiya

    IPC: H01L23/427 ,  H01L23/40 ,  F28D15/02 ,  H05K7/20

    Abstract: A cooler grows in size and its structure becomes complicated in a phase-change cooler if it is intended to cool a plurality of heating elements; therefore, a phase-change cooler according to an exemplary aspect of the present invention includes a heat-conducting board configured to be thermally connected to a cooling object; heat receiving means for storing a refrigerant and receiving heat of the cooling object through the heat-conducting board; radiation means for radiating heat, condensing and devolatilizing a vapor-phase refrigerant arising from vaporization of the refrigerant in the heat receiving means; and connection means for connecting the heat receiving means and the radiation means.

    Cooling apparatus and cooling system
    2.
    发明授权
    Cooling apparatus and cooling system 有权
    冷却装置和冷却系统

    公开(公告)号：US09459031B2

    公开(公告)日：2016-10-04

    申请号：US14378659

    申请日：2013-02-13

    Applicant: NEC Corporation

    Inventor： Kenichi Inaba ,  Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Akira Shoujiguchi ,  Masaki Chiba ,  Arihiro Matsunaga

    IPC: F25B43/00 ,  G06F1/20 ,  H05K7/20 ,  F28D15/02 ,  F25B39/00 ,  F25B39/02 ,  F25B39/04

    CPC classification number: F25B43/00 ,  F25B39/00 ,  F25B39/02 ,  F25B39/04 ,  F28D15/0266 ,  G06F1/20 ,  H05K7/20818

    Abstract: A cooling apparatus includes N (N is an integer of 2 or larger) refrigerant storage units arranged in a vertical direction and configured to store refrigerants, a condensation unit disposed above the N refrigerant storage units, a steam pipe for circulating gas phase refrigerants flowing out of the N refrigerant storage units to the condensation unit, a liquid pipe for circulating a liquid phase refrigerant flowing out of the condensation unit to an uppermost refrigerant storage unit, and separation piping for circulating a liquid phase refrigerant flowing out of an upper refrigerant storage unit to a lower refrigerant storage unit. The liquid phase refrigerant flows into each refrigerant storage unit via an inlet, and flows out from the refrigerant storage unit via a first connection port formed below the inlet.

    Abstract translation: 一种冷却装置，其特征在于，包括N个（N为2以上的整数）制冷剂储存单元，其沿垂直方向配置，构成为储存制冷剂，冷凝单元设置在所述N个制冷剂储存单元的上方;蒸气管，其使流出的气相制冷剂循环 的N个制冷剂储存单元的冷凝装置，将从冷凝装置流出的液相制冷剂循环到最上层的制冷剂储存部的液体管，以及使从上部制冷剂储存部流出的液相制冷剂循环的分离配管 到下部制冷剂储存单元。 液相制冷剂经由入口流入各制冷剂储存单元，经由形成在入口下方的第一连接口从制冷剂储存单元流出。

    COOLING APPARATUS, HEAT RECEIVING SECTION AND BOILING SECTION USED THEREIN, AND METHOD OF MANUFACTURING THE SAME
    4.
    发明申请
    COOLING APPARATUS, HEAT RECEIVING SECTION AND BOILING SECTION USED THEREIN, AND METHOD OF MANUFACTURING THE SAME 有权
    冷却装置，加热部分及其使用的沸腾部分及其制造方法

    公开(公告)号：US20150241096A1

    公开(公告)日：2015-08-27

    申请号：US14427487

    申请日：2013-07-19

    Applicant: NEC Corporation

    Inventor： Arihiro Matsunaga ,  Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Akira Shoujiguchi ,  Masaki Chiba ,  Kenichi Inaba

    IPC: F25B39/02 ,  B23P15/26

    CPC classification number: F25B39/028 ,  B23P15/26 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49359 ,  H01L2924/00

    Abstract: In order to maintain a high cooling capability even in a case where a heating element has a lower calorific value, a boiling section of a heat receiving section in a phase change cooling apparatus includes a comb-shaped structure and a porous layer provided on a bottom portion of the comb-shaped structure between fins of the comb-shaped structure. With such a boiling section, a liquid film of a liquid phase refrigerant is forcedly made thinner. Thus, the liquid phase refrigerant is changed in phase into a gaseous phase refrigerant even in a case of a small difference between the temperature of the gaseous phase refrigerant and the temperature of the heat receiving surface.

    Abstract translation: 为了即使在加热元件具有较低的发热量的情况下也能保持高的冷却能力，相变冷却装置中的受热部的沸腾部分包括梳状结构和设置在底部的多孔层 该梳形结构的一部分在梳形结构的翅片之间。 通过这样的沸腾部分，强制使液相制冷剂的液膜变薄。 因此，即使在气相制冷剂的温度与受热面的温度之间的差异较小的情况下，液相制冷剂也相位变化为气相制冷剂。

    COOLING DEVICE AND ELECTRONIC DEVICE USING THE SAME
    5.
    发明申请
    COOLING DEVICE AND ELECTRONIC DEVICE USING THE SAME 审中-公开

    公开(公告)号：US20140331709A1

    公开(公告)日：2014-11-13

    申请号：US14370190

    申请日：2012-12-12

    Applicant: NEC Corporation

    Inventor： Masaki Chiba ,  Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Akira Shoujiguchi ,  Kenichi Inaba ,  Arihiro Matsunaga

    IPC: H05K7/20 ,  F25B39/00 ,  F25B39/04 ,  F28D15/02 ,  F25B39/02

    CPC classification number: H05K7/2029 ,  F25B39/00 ,  F25B39/02 ,  F25B39/04 ,  F28D15/02 ,  F28D15/0266 ,  F28F13/06 ,  F28F2250/08 ,  H01L23/367 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20309 ,  H05K7/20318 ,  H01L2924/00

    Abstract: When a cooling device employing an ebullient cooling system is mounted in a low-profile electronic device, not only is it impossible to obtain the sufficient cooling performance, but also the cooling efficiency of the entire electronic device decreases, therefore, a cooling device according to an exemplary aspect of the invention includes evaporating means for storing a refrigerant; condensing means for condensing and liquefying a vapor-phase refrigerant vaporized in the evaporation means and radiating heat; a pipe connecting the evaporating means to the condensing means; and flow regulating means for regulating a flow direction of air passing through the condensing means, wherein the evaporating means and the condensing means are located on roughly the same level in the vertical direction; the evaporating means includes an evaporation container and bulkhead means for separating the refrigerant disposed in the evaporation container; the height of the bulkhead means is larger than or equal to the height of a vapor-liquid interface of the refrigerant and is smaller than the height of the evaporation container; the pipe includes a vapor pipe through which vapor-phase refrigerant flows and a liquid pipe through which condensed and liquefied liquid-phase refrigerant flows; the condensing means includes first condensing means and second condensing means which differ in condensing-means height which is defined as the height in vertical direction of a condensation container composing the condensing means, and the condensing-means height of the first condensing means is configured to be larger than the condensing-means height of the second condensing means; the first condensing means includes a vapor pipe connection portion which is connected to the vapor pipe at the position above the condensing-means height of the second condensing means in vertical direction; and the flow regulating means is disposed in the upper part of the second condensing means.

    ELECTRONIC SUBSTRATE HOUSING EQUIPMENT AND ELECTRIC APPARATUS
    6.
    发明申请
    ELECTRONIC SUBSTRATE HOUSING EQUIPMENT AND ELECTRIC APPARATUS 审中-公开
    电子基板外壳设备和电气设备

    公开(公告)号：US20140321056A1

    公开(公告)日：2014-10-30

    申请号：US14361930

    申请日：2012-11-16

    Applicant: NEC Corporation

    Inventor： Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Masaki Chiba ,  Kenichi Inaba ,  Arihiro Matsunaga

    IPC: H05K7/20

    CPC classification number: H05K7/20354 ,  H05K7/20154 ,  H05K7/20727 ,  H05K7/20818

    Abstract: An electronic substrate 200A mounts a heater element 220. A chassis 300A houses an electronic substrate 200 in an airtight manner. A cooling unit 400 cools the electronic substrate 200. The cooling unit 400 includes a heat receiving part 410 and a heat radiation part 420. The heat receiving part 410 receives heat from the electronic substrate 200. The heat radiation part 420 is connected with the heat receiving part 410, and radiates heat from the electronic substrate 200 which has received by the heat receiving part 410. Further, the heat receiving part 410 is provided in the chassis 300A in an airtight manner, and the heat radiation part 420 is provided outside the chassis 300. As a result, efficient cooling is possible, and moreover, maintenance replacement work can be performed for each piece of electronic substrate housing equipment individually.

    Abstract translation: 电子基板200A安装加热元件220.底座300A以气密的方式容纳电子基板200。 冷却单元400冷却电子基板200.冷却单元400包括热接收部分410和散热部分420.热接收部分410从电子基板200接收热量。散热部分420与热量 接收部分410，并且从由热接收部分410接收的电子基板200辐射热量。此外，热接收部分410以气密的方式设置在机架300A中，并且散热部分420设置在 结果，可以有效地进行冷却，此外，可以分别对每个电子基板收纳设备执行维护更换工作。

    CONNECTING STRUCTURE OF COOLING DEVICE, COOLING DEVICE, AND METHOD FOR CONNECTING COOLING DEVICE
    7.
    发明申请
    CONNECTING STRUCTURE OF COOLING DEVICE, COOLING DEVICE, AND METHOD FOR CONNECTING COOLING DEVICE 有权
    冷却装置，冷却装置的连接结构和连接冷却装置的方法

    公开(公告)号：US20150131229A1

    公开(公告)日：2015-05-14

    申请号：US14401282

    申请日：2013-05-10

    Applicant: NEC Corporation

    Inventor： Arihiro Matsunaga ,  Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Akira Shoujiguchi ,  Masaki Chiba ,  Kenichi Inaba

    IPC: H05K7/20 ,  B23P15/26

    CPC classification number: H05K7/20336 ,  B23P15/26 ,  F28D15/0266 ,  F28D15/0275 ,  F28F2275/08 ,  H01L23/4006 ,  H01L23/427 ,  H01L2023/4062 ,  H01L2924/0002 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/2039 ,  Y10T29/4913 ,  Y10T29/53174 ,  H01L2924/00

    Abstract: It is impossible in a cooling device using a phase-change system, seeking high heat transport performance, to obtain sufficient cooling performance due to the increase in thermal resistance with a heating element to be cooled, therefore, a connecting structure of a cooling device according to an exemplary aspect of the present invention includes a connecting board with an opening; a pressing plate of thin plate elastically deformable; first fixing means for fixing the pressing plate to the connecting board with the pressing plate disposed covering heat receiving means composing the cooling device; and second fixing means for fixing the connecting board to a substrate with the heat receiving means abutting against a heating element mounted on the substrate and disposed in the opening.

    Abstract translation: 由于与要冷却的加热元件的热​​阻增加，因此使用相变系统的冷却装置，寻求高的热输送性能，以获得足够的冷却性能是不可能的，因此，冷却装置的连接结构 本发明的示例性方面包括具有开口的连接板; 薄板的压板可弹性变形; 第一固定装置，用于将压板固定到连接板上，其中压板设置成覆盖构成冷却装置的热接收装置; 以及第二固定装置，用于将所述连接板固定到基板上，所述热接收装置抵靠安装在所述基板上并设置在所述开口中的加热元件。

    SEALED CASING
    8.
    发明申请
    SEALED CASING 审中-公开
    密封箱

    公开(公告)号：US20140083652A1

    公开(公告)日：2014-03-27

    申请号：US14118556

    申请日：2012-05-21

    Applicant: NEC Corporation

    Inventor： Arihiro Matsunaga ,  Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Masaki Chiba ,  Kenichi Inaba

    IPC: F28D15/02

    CPC classification number: F28D15/025 ,  F28D15/0266 ,  F28D15/0275 ,  H01L23/10 ,  H01L23/4006 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A sealed casing includes a container provided with a plurality of opening and houses at least one heat-generating body, and a plurality of top boards sealing the openings respectively, and is characterized in that at least one of the openings is disposed in a heat-generating area where the heat-generating body is disposed, and that a cooling unit is disposed on the top board sealing the opening in the heat-generating area.

    Abstract translation: 密封壳体包括设置有多个开口并容纳至少一个发热体的容器和分别密封开口的多个顶板，其特征在于，至少一个开口设置在热交换器中， 并且在顶板上设置冷却单元，该冷却单元密封发热区域中的开口。

    COOLING DEVICE AND ELECTRIC EQUIPMENT USING THE SAME
    9.
    发明申请
    COOLING DEVICE AND ELECTRIC EQUIPMENT USING THE SAME 审中-公开
    冷却装置和使用该装置的电气设备

    公开(公告)号：US20140326016A1

    公开(公告)日：2014-11-06

    申请号：US14370194

    申请日：2012-12-21

    Applicant: NEC Corporation

    Inventor： Akira Shoujiguchi ,  Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Masaki Chiba ,  Kenichi Inaba ,  Arihiro Matsunaga

    IPC: H05K7/20 ,  F25B39/00

    CPC classification number: H05K7/208 ,  F25B39/00 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20809 ,  H01L2924/00

    Abstract: A cooling device of the present invention is a cooling device arranged in a chassis equipped with an upper surface, and comprises: a refrigerant; a vaporizer that includes an evaporative vessel having a side face of a curved surface shape, and performs heat-absorption by making the refrigerant change its phase from a liquid phase state to a vapor phase state; a condenser that performs heat-radiation by making the refrigerant change its phase from a vapor phase state to a liquid phase state; a pipe that connects the vaporizer and the condenser; and a flow path suppression means for suppressing a cooling wind that flows between an area over the evaporative vessel and the upper surface.

    Abstract translation: 本发明的冷却装置是布置在具有上表面的底盘中的冷却装置，包括：制冷剂; 蒸发器，其包括具有弯曲表面形状的侧面的蒸发容器，并且通过使制冷剂将其相位从液相状态转变为气相状态来进行吸热; 通过使制冷剂将其相位从气相状态转变为液相状态而进行热辐射的冷凝器; 连接蒸发器和冷凝器的管道; 以及流路抑制装置，用于抑制在蒸发容器上方的区域和上表面之间流动的冷却风。

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