Invention Grant
- Patent Title: System-in-package logic and method to control an external packaged memory device
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Application No.: US14809132Application Date: 2015-07-24
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Publication No.: US09972610B2Publication Date: 2018-05-15
- Inventor: Bilal Khalaf
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Compass IP Law PC
- Main IPC: G11C7/00
- IPC: G11C7/00 ; H01L25/18 ; H01L25/00 ; G06F3/06

Abstract:
Techniques and mechanisms for a SIP to control access to a non-volatile memory of another packaged device. In an embodiment, the SIP includes interface a processor, a local memory and a memory controller that provides the processor with access to the local memory. The SIP further includes interface hardware to couple the SIP to the packaged device, wherein the processor of the SIP accesses a non-volatile memory of the packaged device via the memory controller of the SIP. In another embodiment, the interface hardware of the SIP includes a first plurality of contacts to couple to the packaged device, as well as a second plurality of contacts. An interface standard describe an arrangement of interface contacts, wherein, of a first arrangement of the first contacts and the second arrangement of the second contacts, only the second arrangement conforms to the described arrangement of interface contacts.
Public/Granted literature
- US20170025400A1 SYSTEM-IN-PACKAGE LOGIC AND METHOD TO CONTROL AN EXTERNAL PACKAGED MEMORY DEVICE Public/Granted day:2017-01-26
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