- 专利标题： Resin composition, prepreg, metal-foil-clad laminate, resin composite sheet, and printed wiring board
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申请号： US15501654申请日： 2016-01-27
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公开(公告)号： US09974169B2公开(公告)日： 2018-05-15
- 发明人: Takashi Kobayashi , Kentaro Takano , Sotaro Hiramatsu
- 申请人： MITSUBISHI GAS CHEMICAL COMPANY, INC.
- 申请人地址： JP Tokyo
- 专利权人： MITSUBISHI GAS CHEMICAL COMPANY, INC.
- 当前专利权人： MITSUBISHI GAS CHEMICAL COMPANY, INC.
- 当前专利权人地址： JP Tokyo
- 代理机构： Greenblum & Bernstein, P.L.C.
- 优先权： JP2015-019302 20150203
- 国际申请： PCT/JP2016/052349 WO 20160127
- 国际公布： WO2016/125657 WO 20160811
- 主分类号： B32B27/38
- IPC分类号： B32B27/38 ; C08G59/50 ; H05K1/03 ; C08G8/28 ; C08J5/24 ; C08G71/04 ; C08K3/36 ; C08K5/098 ; B32B15/14 ; B32B5/02 ; B32B15/20 ; D06M15/564 ; D06M101/00
摘要：
A resin composition for a printed wiring board containing a cyanate compound (A); a maleimide compound (B); and a benzoguanamine compound (C) having an aminomethyl group represented by the following general formula (1): wherein R is a hydrogen atom or a substituent selected from a group consisting of a hydrocarbon group having 1 to 10 carbon atoms, an alkoxyl group having 1 to 10 carbon atoms, an aryloxy group having 6 to 10 carbon atoms, a hydroxyl group, an amide group, and a halogen atom, and n is an integer of 1 to 2.