发明授权
- 专利标题： Bonding structure for semiconductor package and method of manufacturing the same
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申请号： US15294508申请日： 2016-10-14
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公开(公告)号： US09984993B2公开(公告)日： 2018-05-29
- 发明人: Min-Fong Shu , Yi-Hsiu Tseng , Kuan-Neng Chen , Shu-Chiao Kuo
- 申请人： Advanced Semiconductor, Inc.
- 申请人地址： TW Kaosiung
- 专利权人： ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- 当前专利权人： ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- 当前专利权人地址： TW Kaosiung
- 代理机构： Foley & Lardner LLP
- 代理商 Cliff Z. Liu
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L23/13 ; H01L23/498 ; H01L23/31 ; H01L21/48 ; H01L21/56
摘要：
A method of manufacturing a bonding structure includes (a) providing a substrate, wherein the substrate includes a top surface and at least one bonding pad disposed adjacent to the top surface of the substrate, at least one bonding pad having a sloped surface with a first slope; (b) providing a semiconductor element, wherein the semiconductor element includes at least one pillar, and at least one pillar has a sidewall with a second slope, wherein the absolute value of the first slope is smaller than the absolute value of the second slope; and (c) bonding at least one pillar to a portion of the sloped surface of corresponding ones of the at least one bonding pad.
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