Invention Grant
- Patent Title: Method of forming high electron mobility transistor
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Application No.: US15362465Application Date: 2016-11-28
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Publication No.: US09985103B2Publication Date: 2018-05-29
- Inventor: Fu-Wei Yao , Chen-Ju Yu , King-Yuen Wong , Chun-Wei Hsu , Jiun-Lei Jerry Yu , Fu-Chih Yang , Chun-Lin Tsai
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/45 ; H01L29/20 ; H01L29/205 ; H01L21/02 ; H01L21/285 ; H01L29/417 ; H01L29/778 ; H01L29/08

Abstract:
A high electron mobility transistor (HEMT) includes a first III-V compound layer. A second III-V compound layer is disposed on the first III-V compound layer and is different from the first III-V compound layer in composition. A salicide source feature and a salicide drain feature are in contact with the first III-V compound layer through the second III-V compound layer. A gate electrode is disposed over a portion of the second III-V compound layer between the salicide source feature and the salicide drain feature.
Public/Granted literature
- US20170077255A1 METHOD OF FORMING HIGH ELECTRON MOBILITY TRANSISTOR Public/Granted day:2017-03-16
Information query
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