Invention Grant
- Patent Title: Fabrication process for mitigating external resistance of a multigate device
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Application No.: US15426566Application Date: 2017-02-07
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Publication No.: US09985113B2Publication Date: 2018-05-29
- Inventor: Anirban Basu , Guy Cohen , Amlan Majumdar
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Louis Percello
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L29/08 ; H01L29/201 ; H01L29/205

Abstract:
A method for fabricating a multigate device includes forming a fin on a substrate of the multigate device, the fin being formed of a semiconductor material, growing a first conformal epitaxial layer directly on the fin and substrate, wherein the first conformal epitaxial layer is highly doped, growing a second conformal epitaxial layer directly on the first conformal epitaxial layer, wherein the second conformal epitaxial layer is highly doped, selectively removing a portion of second epitaxial layer to expose a portion of the first conformal epitaxial layer, selectively removing a portion of the first conformal epitaxial layer to expose a portion of the fin and thereby form a trench, and forming a gate within the trench.
Public/Granted literature
- US20170148896A1 FABRICATION PROCESS FOR MITIGATING EXTERNAL RESISTANCE OF A MULTIGATE DEVICE Public/Granted day:2017-05-25
Information query
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