- 专利标题: Semiconductor device including a mesa groove and a recess groove
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申请号: US15464112申请日: 2017-03-20
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公开(公告)号: US09985127B2公开(公告)日: 2018-05-29
- 发明人: Yukihisa Ueno , Nariaki Tanaka
- 申请人: TOYODA GOSEI CO., LTD.
- 申请人地址: JP Kiyosu-Shi, Aichi-Ken
- 专利权人: TOYODA GOSEI CO., LTD.
- 当前专利权人: TOYODA GOSEI CO., LTD.
- 当前专利权人地址: JP Kiyosu-Shi, Aichi-Ken
- 代理机构: McGinn IP Law Group, PLLC
- 优先权: JP2016-066581 20160329
- 主分类号: H01L29/78
- IPC分类号: H01L29/78 ; H01L29/20 ; H01L29/66 ; H01L29/08 ; H01L29/10 ; H01L21/265 ; H01L29/40 ; H01L29/06
摘要:
To improve the breakdown voltage of a semiconductor device. In a terminal region of the semiconductor device, a mesa groove, a recess groove, an electric field relaxation region, and a gradient distributed low concentration p-type layer region are formed. A recess groove is fromed between a device region and the mesa groove so as to surround the device region. A region where a p-type layer is thinned by the recess groove is the electric field relaxation region. The gradient distributed low concentration p-type layer region is formed on the surface of the electric field relaxation region. The average carrier concentration of the entire gradient distributed low concentration p-type layer region is lower than the carrier concentration of the p-type layer. By forming the gradient distributed low concentration p-type layer region, the electric field relaxation region is quickly completely depleted when a reverse voltage is applied, thereby improving the breakdown voltage.
公开/授权文献
- US20170288050A1 SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR 公开/授权日:2017-10-05
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