- 专利标题： Camera module including multilayer base body, image sensor IC, lens unit, peripheral circuit components, and connector element and electronic device including same
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申请号： US15722007申请日： 2017-10-02
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公开(公告)号： US09986139B2公开(公告)日： 2018-05-29
- 发明人: Shigeru Tago , Hirofumi Shinagawa , Jerry Hsieh , Satoshi Sasaki , Jun Sasaki , Nobuo Ikemoto , Yuki Wakabayashi
- 申请人： Murata Manufacturing Co., Ltd.
- 申请人地址： JP Kyoto
- 专利权人： MURATA MANUFACTURING CO., LTD.
- 当前专利权人： MURATA MANUFACTURING CO., LTD.
- 当前专利权人地址： JP Kyoto
- 代理机构： Keating & Bennett, LLP
- 优先权： JP2013-044844 20130307; JP2013-114136 20130530; WOPCT/JP2014/052026 20140130
- 主分类号： H04N5/225
- IPC分类号： H04N5/225
摘要：
A camera module includes a multilayer base body including a first mounting portion, a second mounting portion, and a connecting portion. The first mounting portion and the second mounting portion are connected to the connecting portion. A connector element is arranged in the second mounting portion. The first mounting portion includes a cavity, and a penetration hole penetrating from the cavity to one surface of the first mounting portion. An image sensor IC is arranged in the cavity, and the lens unit is arranged on the one surface of the first mounting portion at a location at or near the penetration hole. Peripheral circuit components and conductor patterns are mounted to or incorporated in the first mounting portion.
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