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公开(公告)号：US09986139B2
公开(公告)日：2018-05-29
申请号：US15722007
申请日：2017-10-02
发明人： Shigeru Tago , Hirofumi Shinagawa , Jerry Hsieh , Satoshi Sasaki , Jun Sasaki , Nobuo Ikemoto , Yuki Wakabayashi
IPC分类号： H04N5/225
CPC分类号： H04N5/2253 , H04N5/2254 , H04N5/2257
摘要： A camera module includes a multilayer base body including a first mounting portion, a second mounting portion, and a connecting portion. The first mounting portion and the second mounting portion are connected to the connecting portion. A connector element is arranged in the second mounting portion. The first mounting portion includes a cavity, and a penetration hole penetrating from the cavity to one surface of the first mounting portion. An image sensor IC is arranged in the cavity, and the lens unit is arranged on the one surface of the first mounting portion at a location at or near the penetration hole. Peripheral circuit components and conductor patterns are mounted to or incorporated in the first mounting portion.
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公开(公告)号：US09813595B2
公开(公告)日：2017-11-07
申请号：US14840103
申请日：2015-08-31
发明人： Shigeru Tago , Hirofumi Shinagawa , Jerry Hsieh , Satoshi Sasaki , Jun Sasaki , Nobuo Ikemoto , Yuki Wakabayashi
IPC分类号： H04N5/225
CPC分类号： H04N5/2253 , H04N5/2254 , H04N5/2257
摘要： A camera module includes a multilayer base body including a first mounting portion, a second mounting portion, and a connecting portion. The first mounting portion and the second mounting portion are connected to the connecting portion. A connector element is arranged in the second mounting portion. The first mounting portion includes a cavity, and a penetration hole penetrating from the cavity to one surface of the first mounting portion. An image sensor IC is arranged in the cavity, and the lens unit is arranged on the one surface of the first mounting portion at a location at or near the penetration hole. Peripheral circuit components and conductor patterns are mounted to or incorporated in the first mounting portion.
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公开(公告)号：US10477084B2
公开(公告)日：2019-11-12
申请号：US14826438
申请日：2015-08-14
发明人： Nobuo Ikemoto , Atsushi Kumano , Jerry Hsieh , Jun Sasaki
IPC分类号： H04N5/225 , H01L27/146 , H05K3/00 , H05K5/00
摘要： A manufacturing method for a camera module including a multilayer body in which an image sensor IC and a lens are arranged with an optical path provided in the multilayer body being disposed therebetween includes a first step and a second step. In the first step, the multilayer body is formed by stacking and combining flexible sheets. In the second step, a through hole is formed in flexible base material layers that constitute a portion of the multilayer body to form the optical path defined by the through hole.
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公开(公告)号：US09983689B2
公开(公告)日：2018-05-29
申请号：US14449175
申请日：2014-08-01
发明人： Naoto Ikeda , Jerry Hsieh
CPC分类号： G06F3/021 , G06F1/1662 , G06F1/1698 , G06F3/0202 , G06K7/10336 , H01H13/70 , H04B5/0037
摘要： A coil antenna is provided on an inner surface of a key-top of a key input unit. A power supply coil that is magnetically coupled to the coil antenna and an RFIC are mounted on a substrate holding key switches. A device including an NFC is arranged closer to the key-top so as to make communication with the NFC. Further, a tag of an RFID is arranged closer thereto so as to be read. Thus, a key input unit and an electronic apparatus are configured in which an antenna is not provided on a housing externally and is less influenced by the housing of the electronic apparatus into which the antenna is incorporated.
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公开(公告)号：US09197803B2
公开(公告)日：2015-11-24
申请号：US14483190
申请日：2014-09-11
发明人： Nobuo Ikemoto , Atsushi Kumano , Jerry Hsieh , Jun Sasaki
IPC分类号： H04N5/225 , H05K1/18 , H01L27/146 , H05K1/02
CPC分类号： H04N5/2257 , H01L27/14618 , H01L2224/16225 , H04N5/2253 , H04N5/2254 , H05K1/0298 , H05K1/182 , H05K1/185 , H05K2201/09845 , H05K2201/10121
摘要： A camera module includes an image sensor IC, a resin multilayer board including thermoplastic resin layers stacked in a direction perpendicular or substantially perpendicular to a light receiving surface of the image sensor IC, a mounting electrode which is stacked on the thermoplastic resin layer and on which the image sensor IC is mounted, and a via-hole conductor electrically connected to the mounting electrode. The resin multilayer board includes a flat plate portion including a surface on which the mounting electrode is mounted, and a rigid portion including a greater number of thermoplastic resin layers than that of the flat plate portion, and the via-hole conductor is arranged in the flat plate portion so as to avoid the thermoplastic resin layer on which the mounting electrode is stacked.
摘要翻译： 相机模块包括图像传感器IC，包括沿垂直于或基本垂直于图像传感器IC的光接收表面的方向堆叠的热塑性树脂层的树脂多层板，堆叠在热塑性树脂层上的安装电极， 安装图像传感器IC，以及电连接到安装电极的通孔导体。 树脂多层板包括平板部分，其中安装有安装电极的表面和包含比平板部分多的热塑性树脂层的刚性部分，并且通孔导体布置在 平板部分，以避免堆叠安装电极的热塑性树脂层。
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