A wafer assembly for an electrical connector that has a first and second wafers configured to interlock with one another. Each of the wafers has at least one contact that has a body portion with a mating end for coupling to a mating contact and a tail end opposite the mating end for engaging a printed circuit board and an overmold covering the body portion such that the mating and tail ends extend from opposite sides of the overmold. A conductive elongated spring member is sandwiched between the first and second wafers. The wafer assembly can include one or more filter components.