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公开(公告)号：US10243307B2
公开(公告)日：2019-03-26
申请号：US15944268
申请日：2018-04-03
申请人： Amphenol Corporation
发明人： Zlatan Ljubijankic , Andy Toffelmire , Peter E. Jay , Barbara H. Marten , Valeria Caraiani , Andrew B. Matus
IPC分类号： H01R12/00 , H01R13/7197 , H01R13/6581 , H01R13/405 , H01R12/71
摘要： A wafer assembly for an electrical connector, and method for making, that has a first and second wafers configured to interlock with one another. Each of the wafers has at least one contact that has a body portion with a mating end for coupling to a mating contact and a tail end opposite the mating end for engaging a printed circuit board where the mating and tail ends extend from opposite sides of the wafer. A conductive spring member is sandwiched between the first and second wafers. The wafer assembly can include one or more electronic components in electrical contact with the spring member and one of the contacts.
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公开(公告)号：US20190067888A1
公开(公告)日：2019-02-28
申请号：US15944268
申请日：2018-04-03
申请人： Amphenol Corporation
发明人： Zlatan LJUBIJANKIC , Andy Toffelmire , Peter E. Jay , Barbara H. Marten , Valeria Caraiani , Andrew B. Matus
IPC分类号： H01R13/7197 , H01R12/71 , H01R13/405 , H01R13/6581
摘要： A wafer assembly for an electrical connector, and method for making, that has a first and second wafers configured to interlock with one another. Each of the wafers has at least one contact that has a body portion with a mating end for coupling to a mating contact and a tail end opposite the mating end for engaging a printed circuit board where the mating and tail ends extend from opposite sides of the wafer. A conductive spring member is sandwiched between the first and second wafers. The wafer assembly can include one or more electronic components in electrical contact with the spring member and one of the contacts.
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公开(公告)号：US11223166B2
公开(公告)日：2022-01-11
申请号：US16853216
申请日：2020-04-20
申请人： Amphenol Corporation
IPC分类号： H01R13/6585 , H05K3/34 , H01R12/71 , H01R13/11 , H01R43/16 , H01R43/24 , H01R13/512 , H01R12/70
摘要： An electrical connector and method of assembling an electrical connector that is configured for mounting to a printed circuit board. The electrical connector has interleaved contact wafers to form one or more contact wafer assemblies that are supported by an insert of the electrical connector, such that the one or more contact wafer assemblies form a predetermined arrangement of mating ends of the plurality of contacts at a mating interface of the electrical connector.
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公开(公告)号：US10770839B2
公开(公告)日：2020-09-08
申请号：US16108633
申请日：2018-08-22
申请人： Amphenol Corporation
IPC分类号： H01R13/6585 , H05K3/34 , H01R12/71 , H01R13/11 , H01R43/16 , H01R43/24 , H01R13/512 , H01R12/70
摘要： A method of assembling an electrical connector that is configured for mounting to a printed circuit board. The method has the steps of providing contact wafers with a plurality of contacts; bending the tail ends of each contact wafer; interleaving the contact wafers to form one or more contact wafer assemblies; loading the contact wafer assemblies into an insert of the electrical connector, such that the one or more contact wafer assemblies form a predetermined arrangement of mating ends of the plurality of contacts at a mating interface of the electrical connector; and inserting the insert into a shell of the electrical connector.
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公开(公告)号：US20200067236A1
公开(公告)日：2020-02-27
申请号：US16108633
申请日：2018-08-22
申请人： Amphenol Corporation
IPC分类号： H01R13/6585 , H05K3/34 , H01R12/71 , H01R12/70 , H01R43/16 , H01R43/24 , H01R13/512 , H01R13/11
摘要： A method of assembling an electrical connector that is configured for mounting to a printed circuit board. The method has the steps of providing contact wafers with a plurality of contacts; bending the tail ends of each contact wafer; interleaving the contact wafers to form one or more contact wafer assemblies; loading the contact wafer assemblies into an insert of the electrical connector, such that the one or more contact wafer assemblies form a predetermined arrangement of mating ends of the plurality of contacts at a mating interface of the electrical connector; and inserting the insert into a shell of the electrical connector.
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公开(公告)号：US20200287331A1
公开(公告)日：2020-09-10
申请号：US16853216
申请日：2020-04-20
申请人： Amphenol Corporation
IPC分类号： H01R13/6585 , H05K3/34 , H01R12/71 , H01R13/11 , H01R43/16 , H01R43/24 , H01R13/512 , H01R12/70
摘要： An electrical connector and method of assembling an electrical connector that is configured for mounting to a printed circuit board. The electrical connector has interleaved contact wafers to form one or more contact wafer assemblies that are supported by an insert of the electrical connector, such that the one or more contact wafer assemblies form a predetermined arrangement of mating ends of the plurality of contacts at a mating interface of the electrical connector.
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公开(公告)号：US09991642B1
公开(公告)日：2018-06-05
申请号：US15683203
申请日：2017-08-22
申请人： Amphenol Corporation
发明人： Zlatan Ljubijankic , Andy Toffelmire , Peter E. Jay , Barbara H. Marten , Valeria Caraiani , Andrew B. Matus
IPC分类号： H01R12/00 , H01R13/6586 , H01R12/72 , H01R13/08 , H01R13/6464 , H01R13/405 , H01R43/20
CPC分类号： H01R13/6586 , H01R12/727 , H01R13/08 , H01R13/24 , H01R13/405 , H01R13/514 , H01R13/518 , H01R13/6464 , H01R13/6587 , H01R43/205 , H01R43/24
摘要： A wafer assembly for an electrical connector that has a first and second wafers configured to interlock with one another. Each of the wafers has at least one contact that has a body portion with a mating end for coupling to a mating contact and a tail end opposite the mating end for engaging a printed circuit board and an overmold covering the body portion such that the mating and tail ends extend from opposite sides of the overmold. A conductive elongated spring member is sandwiched between the first and second wafers. The wafer assembly can include one or more filter components.
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