- 专利标题: Rack system cooling with inclined computing devices
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申请号: US14163939申请日: 2014-01-24
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公开(公告)号: US09992913B1公开(公告)日: 2018-06-05
- 发明人: Michael Phillip Czamara , Osvaldo P. Morales , Peter George Ross
- 申请人: Amazon Technologies, Inc.
- 申请人地址: US NV Reno
- 专利权人: Amazon Technologies, Inc.
- 当前专利权人: Amazon Technologies, Inc.
- 当前专利权人地址: US NV Reno
- 代理机构: Meyertons, Hood, Kivlin, Kowert & Goetzel, P.C.
- 代理商 Robert C. Kowert
- 主分类号: H05K7/20
- IPC分类号: H05K7/20 ; G06F1/20
摘要:
A data center includes one or more racks, one or more computing devices coupled to at least one of the racks, and one or more air moving devices. The computing devices include heat producing components. The computing devices may be inclined in the rack such that the lower ends of the computing devices are at a lower elevation than the higher ends of the computing devices. The air moving devices can move air from the lower end of the inclined computing devices to the higher end of the inclined computing devices such that heat is removed from heat producing components in the inclined computing devices.
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