Invention Grant
- Patent Title: Insulating thermally conductive resin composition
-
Application No.: US15310152Application Date: 2015-04-22
-
Publication No.: US09997274B2Publication Date: 2018-06-12
- Inventor: Yuki Kotani , Hiroyoshi Yoden
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Priority: JP2014-101032 20140515
- International Application: PCT/JP2015/002187 WO 20150422
- International Announcement: WO2015/174023 WO 20151119
- Main IPC: H01B3/40
- IPC: H01B3/40 ; C09K5/14 ; C08L63/00

Abstract:
An insulating thermally conductive resin composition (10) includes a matrix resin (1) and insulators (2). The insulators (2) are dispersed in the matrix resin and have electrical insulation. The insulating thermally conductive resin composition further includes a thermally conductive phase (3) which has a hither thermal conductivity than the matrix resin and thermally connects the insulators with each other. The thermally conductive phase (3) is composed of an organic substance. The thermally conductive phase that thermally connects the insulators is composed of the organic substance, so that the resultant insulating thermally conductive resin composition has electrical insulation while having improved thermal conductivity.
Public/Granted literature
- US20170154705A1 INSULATING THERMALLY CONDUCTIVE RESIN COMPOSITION Public/Granted day:2017-06-01
Information query