- Patent Title: Methods of forming configurable microchannels in package structures
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Application No.: US13714582Application Date: 2012-12-14
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Publication No.: US09997377B2Publication Date: 2018-06-12
- Inventor: Arnab Choudhury
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/28 ; H01L21/56 ; H01L25/065 ; H01L23/31 ; H01L23/473 ; H01L21/48
Abstract:
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include forming a sacrificial microchannel material on a device, forming an overmold material on the sacrificial microchannel material, and vaporizing the sacrificial microchannel material to form microchannel structures in the overmold that are conformal to the surfaces of the device.
Public/Granted literature
- US20140167296A1 METHODS OF FORMING CONFIGURABLE MICROCHANNELS IN PACKAGE STRUCTURES Public/Granted day:2014-06-19
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