公开(公告)号：US20190391386A1

公开(公告)日：2019-12-26

申请号：US16464257

申请日：2016-12-27

Applicant: Intel Corporation

Inventor： Kyle Yazzie ,  Anna M. Prakash ,  Suriyakala Ramalingam ,  Liwei Wang ,  Robert Starkston ,  Arnab Choudhury ,  Sandeep S. Iyer ,  Amanuel M. Abebaw ,  Nick Labanok

IPC: G02B26/08 ,  B81C3/00

Abstract: Aspects of the embodiments are directed to coupling a permanent magnet (PM) with a microelectromechanical systems (MEMS) device. In embodiments, an adhesive, such as an epoxy or resin or other adhesive material, can be used to move the PM towards the MEMS device to magnetically couple the PM to the MEMS device. In embodiments, an adhesive that is configured to shrink up on curing can be applied (e.g., using a pick and place tool) to a location between the MEMS device and the PM. As a result of curing, the adhesive can pull the PM towards the MEMS device. In embodiments, an adhesive that is configured to expand as a result of curing can be applied to a location between the PM and a sidewall of the chassis. As a result of curing, the adhesive can push the PM towards the MEMS device. The adhesive can also secure the PM in place.

公开(公告)号：US20170092561A1

公开(公告)日：2017-03-30

申请号：US14863580

申请日：2015-09-24

Applicant: INTEL CORPORATION

Inventor： Feras Eid ,  Arnab Choudhury

IPC: H01L23/427 ,  H01L25/065 ,  H01L21/48 ,  H01L23/373

CPC classification number: H01L23/427 ,  H01L21/4878 ,  H01L21/4882 ,  H01L23/3675 ,  H01L23/373 ,  H01L23/433 ,  H01L25/0652 ,  H01L2224/16225 ,  H01L2224/73253

Abstract: A thermal management solution may be provided for a microelectronic system, wherein a jumping drops vapor chamber is utilized between at least one microelectronic device and an integrated heat spreader. The microelectronic system may comprise a microelectronic device attached by an active surface thereof to a microelectronic substrate. The integrated heat spreader, having a first surface and an opposing second surface, is also attached to the microelectronic substrate with a jumping drops vapor chamber disposed between a back surface of the microelectronic device and the integrated heat spreader second surface. The jumping drops vapor chamber may comprise a vapor space defined by a hydrophilic evaporation surface on the microelectronic device back surface, a hydrophobic condensation surface on the integrated heat spreader second surface, and at least one sidewall extending between the hydrophilic evaporation surface and the hydrophobic condensation surface with a working fluid disposed within the vapor space.

公开(公告)号：US10720371B2

公开(公告)日：2020-07-21

申请号：US15089332

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Prakriti Choudhary ,  Arnab Choudhury

IPC: H01L23/34 ,  H05B6/06 ,  H05B6/10 ,  H01L23/36

Abstract: Embodiments are generally directed to extended temperature operation for electronic systems using induction heating. An embodiment of an apparatus includes an electronic device including: a die or package; a thermal solution coupled with the die or package for cooling of the die or package; and ferromagnetic material, wherein the ferromagnetic material is to generate induction heating of the die or package in response to an alternating magnetic field.

公开(公告)号：US10607909B2

公开(公告)日：2020-03-31

申请号：US16075120

申请日：2016-04-02

Applicant: Intel Corporation

Inventor： Purushotham Kaushik Muthur Srinath ,  Pramod Malatkar ,  Sairam Agraharam ,  Chandra M. Jha ,  Arnab Choudhury ,  Nachiket R. Raravikar

IPC: H01L23/367 ,  H01L23/26 ,  H01L23/433 ,  H01L25/065 ,  H01L23/36 ,  H01L23/00 ,  H01L25/18 ,  H01L23/31

Abstract: In accordance with disclosed embodiments, there are provided methods, systems, and apparatuses for implementing a thermal solution for 3D packaging. For instance, in accordance with one embodiment, there is an apparatus having therein: a substrate layer having electrical traces therein; a first layer functional silicon die electrically interfaced to the electrical traces of the substrate layer, the first layer functional silicon die having a first thermal pad integrated thereupon; a second layer functional silicon die positioned above the first layer functional silicon die, the second layer functional silicon die having a second thermal pad integrated thereupon; and a conductivity layer positioned between the first layer functional silicon die and the second layer functional silicon die, wherein the conductivity layer is to: (i) electrically join the second layer functional silicon die to the first layer functional silicon die and (ii) bond the first thermal pad of the first layer functional silicon die to the second thermal pad of the second layer functional silicon die via solder. Other related embodiments are disclosed.

公开(公告)号：US09806002B2

公开(公告)日：2017-10-31

申请号：US14757845

申请日：2015-12-23

Applicant: INTEL CORPORATION

Inventor： Arnab Choudhury ,  John Beatty ,  Prakriti Choudhary

IPC: H01L23/10 ,  H01L21/00 ,  H05K7/20 ,  H01L23/367 ,  H01L23/373 ,  H01L21/48

CPC classification number: H01L23/3675 ,  H01L21/4871 ,  H01L21/4882 ,  H01L23/10 ,  H01L23/3735 ,  H01L23/42 ,  H01L23/433 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/27334 ,  H01L2224/27848 ,  H01L2224/29019 ,  H01L2224/29021 ,  H01L2224/29022 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29116 ,  H01L2224/29118 ,  H01L2224/2912 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29149 ,  H01L2224/29155 ,  H01L2224/29157 ,  H01L2224/2916 ,  H01L2224/29163 ,  H01L2224/29164 ,  H01L2224/29166 ,  H01L2224/29169 ,  H01L2224/29171 ,  H01L2224/29172 ,  H01L2224/29176 ,  H01L2224/2918 ,  H01L2224/29181 ,  H01L2224/29184 ,  H01L2224/29187 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32058 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/83201 ,  H01L2224/8321 ,  H01L2224/83801 ,  H01L2224/83825 ,  H01L2224/92225 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1304 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/16153 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/0532 ,  H01L2924/01004 ,  H01L2924/0103 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/01048 ,  H01L2924/01072 ,  H01L2924/00012

Abstract: Methods, systems, and apparatuses that assist with cooling semiconductor packages, such as multi-chip packages (MCPs) are described. A semiconductor package includes a component on a substrate. The component can include one or more semiconductor dies. The package can also include a multi-reference integrated heat spreader (IHS) solution (also referred to as a smart IHS solution), where the smart IHS solution includes a smart IHS lid. The smart IHS lid includes a cavity formed in a central region of the smart lid. The smart IHS lid can be on the component, such that the cavity corresponds to the component. A first thermal interface material layer (TIM-layer 1) can be on the component. An individual IHS lid (IHS slug) can be on the TIM-layer 1. The IHS slug can be inserted into the cavity. Furthermore, an intermediate thermal interface material layer (TIM-1A layer) can be between the IHS slug and the cavity.

公开(公告)号：US10030916B2

公开(公告)日：2018-07-24

申请号：US14446123

申请日：2014-07-29

Applicant: INTEL CORPORATION

Inventor： Phi Hung Thanh ,  Paul J. Diglio ,  John C. Johnson ,  Jarett L. Rinaldi ,  Arnab Choudhury

IPC: F28F7/00 ,  F28F1/10 ,  F28F3/12 ,  F28F13/06 ,  H01L23/473

Abstract: A heat transfer apparatus is described having a manifold. The manifold has a surface having a fluidic exit opening and a fluidic entrance opening. A fluid is to flow from the fluidic exit opening and into the fluidic entrance opening. The manifold has a protrusion emanating from the surface between the fluidic exit opening and the fluidic entrance opening. An apparatus is described having a thermally conductive grooved structure. The thermally conductive grooved structure has a surface having first and second cavities to form first and second fluidic channels. The thermally conductive grooved structure has a protrusion emanating from between the cavities. The protrusion has side surfaces to form parts of the first and second fluidic channels.

公开(公告)号：US20140167296A1

公开(公告)日：2014-06-19

申请号：US13714582

申请日：2012-12-14

Applicant: INTEL CORPORATION

Inventor： Arnab Choudhury

IPC: H01L21/56 ,  H01L23/34

CPC classification number: H01L21/565 ,  H01L21/4871 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/473 ,  H01L25/065 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include forming a sacrificial microchannel material on a device, forming an overmold material on the sacrificial microchannel material, and vaporizing the sacrificial microchannel material to form microchannel structures in the overmold that are conformal to the surfaces of the device.

Abstract translation: 描述了形成微电子封装结构的方法及由此形成的相关结构。 这些方法和结构可以包括在器件上形成牺牲微通道材料，在牺牲微通道材料上形成包覆成型材料，以及蒸发牺牲微通道材料，以形成与该器件表面相适应的二次模中的微通道结构。

公开(公告)号：US11022792B2

公开(公告)日：2021-06-01

申请号：US16464257

申请日：2016-12-27

Applicant: Intel Corporation

Inventor： Kyle Yazzie ,  Anna M. Prakash ,  Suriyakala Ramalingam ,  Liwei Wang ,  Robert Starkston ,  Arnab Choudhury ,  Sandeep S. Iyer ,  Amanuel M. Abebaw ,  Nick Labanok

IPC: G02B26/08 ,  B81C3/00

Abstract: Aspects of the embodiments are directed to coupling a permanent magnet (PM) with a microelectromechanical systems (MEMS) device. In embodiments, an adhesive, such as an epoxy or resin or other adhesive material, can be used to move the PM towards the MEMS device to magnetically couple the PM to the MEMS device. In embodiments, an adhesive that is configured to shrink up on curing can be applied (e.g., using a pick and place tool) to a location between the MEMS device and the PM. As a result of curing, the adhesive can pull the PM towards the MEMS device. In embodiments, an adhesive that is configured to expand as a result of curing can be applied to a location between the PM and a sidewall of the chassis. As a result of curing, the adhesive can push the PM towards the MEMS device. The adhesive can also secure the PM in place.

公开(公告)号：US09997377B2

公开(公告)日：2018-06-12

申请号：US13714582

申请日：2012-12-14

Applicant: INTEL CORPORATION

Inventor： Arnab Choudhury

IPC: H01L23/34 ,  H01L23/28 ,  H01L21/56 ,  H01L25/065 ,  H01L23/31 ,  H01L23/473 ,  H01L21/48

CPC classification number: H01L21/565 ,  H01L21/4871 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/473 ,  H01L25/065 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include forming a sacrificial microchannel material on a device, forming an overmold material on the sacrificial microchannel material, and vaporizing the sacrificial microchannel material to form microchannel structures in the overmold that are conformal to the surfaces of the device.

公开(公告)号：US20170186667A1

公开(公告)日：2017-06-29

申请号：US14757997

申请日：2015-12-26

Applicant: Intel Corporation

Inventor： Arnab Choudhury ,  Patrick Nardi ,  William Nicholas Labanok ,  Kelly P. Lofgreen

IPC: H01L23/473 ,  H01L23/00 ,  H01L21/48 ,  H01L23/053 ,  G06F1/20 ,  H01L23/367

CPC classification number: H01L23/473 ,  G06F1/20 ,  G06F2200/201 ,  H01L21/4878 ,  H01L21/4882 ,  H01L23/053 ,  H01L23/3672 ,  H01L24/32 ,  H01L2224/32245

Abstract: Embodiments are generally directed to cooling of electronics using folded foil microchannels. An embodiment of an apparatus includes a semiconductor die; a substrate, the semiconductor die being coupled with the substrate; and a cooling apparatus for the semiconductor die, wherein the cooling apparatus includes a folded foil preform, the folded foil forming a plurality of microchannels, and a fluid coolant system to direct a fluid coolant through the microchannels of the folded foil.