Invention Grant
- Patent Title: Chip package and method for forming the same
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Application No.: US15409289Application Date: 2017-01-18
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Publication No.: US09997473B2Publication Date: 2018-06-12
- Inventor: Yen-Shih Ho , Tsang-Yu Liu , Chia-Sheng Lin , Chaung-Lin Lai
- Applicant: XINTEC INC.
- Applicant Address: TW Taoyuan
- Assignee: XINTEC INC.
- Current Assignee: XINTEC INC.
- Current Assignee Address: TW Taoyuan
- Agency: Liu & Liu
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/78 ; H01L21/52 ; H01L21/54 ; H01L23/18 ; H01L23/055 ; H01L21/48

Abstract:
A chip package including a substrate is provided. The substrate has a first surface and a second surface opposite thereto. The substrate includes a sensing or device region which is adjacent to the first surface. A recess is in the substrate. The recess extends from the second surface towards the first surface, and vertically overlaps the sensing or device region. A redistribution layer is electrically connected to the sensing or device region, and extends from the second surface into the recess. A method of forming the chip package is also provided.
Public/Granted literature
- US20170207182A1 CHIP PACKAGE AND METHOD FOR FORMING THE SAME Public/Granted day:2017-07-20
Information query
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