Invention Grant
- Patent Title: Electrode connecting structure including adhesion layer and electronic device including the same
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Application No.: US15113079Application Date: 2015-01-20
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Publication No.: US09997604B2Publication Date: 2018-06-12
- Inventor: Jaeho Lee , Changseok Lee , Seongjun Park
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2014-0007473 20140121
- International Application: PCT/KR2015/000581 WO 20150120
- International Announcement: WO2015/111898 WO 20150730
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L29/78 ; H01L23/532 ; H01L21/768 ; H01L29/16 ; H01L23/522 ; H01L23/485
Abstract:
Provided are an electrode connecting structure that includes an adhesion layer formed between a graphene layer and a metal layer and an electronic device having the electrode connecting structure. The electrode connecting structure may include an adhesion layer formed of a two-dimensional material provided between the graphene layer and the metal layer. The graphene layer may be a diffusion barrier, and the adhesion layer may stably maintain the interface characteristics of the graphene layer and the metal layer when the metal layer is formed on a surface of the graphene layer.
Public/Granted literature
- US20170025508A1 ELECTRODE CONNECTING STRUCTURE INCLUDING ADHESION LAYER AND ELECTRONIC DEVICE INCLUDING THE SAME Public/Granted day:2017-01-26
Information query
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