- 专利标题： Method for producing product having uneven microstructure on surface thereof, mold release treatment method, and active energy ray curable resin composition for mold surface release treatment
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申请号： US13702075申请日： 2011-06-07
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公开(公告)号： US09999994B2公开(公告)日： 2018-06-19
- 发明人: Tetsuya Jigami , Masayuki Uchida , Shinji Makino , Tadashi Nakamura , Takaya Kawasoe
- 申请人： Tetsuya Jigami , Masayuki Uchida , Shinji Makino , Tadashi Nakamura , Takaya Kawasoe
- 申请人地址： JP Tokyo
- 专利权人： Mitsubishi Chemical Corporation
- 当前专利权人： Mitsubishi Chemical Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： JCIPRNET
- 优先权： JP2010-130366 20100607; JP2010-242375 20101028
- 国际申请： PCT/JP2011/063079 WO 20110607
- 国际公布： WO2011/155499 WO 20111215
- 主分类号： B29C41/42
- IPC分类号： B29C41/42 ; B29C33/62 ; B29C43/22 ; B29C43/28 ; B29C59/04 ; B32B38/06 ; C08F283/06 ; H01L31/0216 ; H01L31/0236 ; B29C59/02
摘要：
The producing method includes: (I) providing an active energy ray curable resin composition for mold surface release treatment between a mold having uneven microstructure on its surface and a substrate, and after curing the resin composition by irradiation with an active energy ray, peeling off the substrate together with a cured article of the active energy ray curable resin composition from the surface of the mold, thereby performing a release treatment to the surface of the mold; and (II), after step (I), providing an active energy ray curable resin composition for shaping between the substrate and the mold, the surface of which has been treated by the release treatment, and after curing the resin composition by an active energy ray, peeling off the substrate together with a cured article of the active energy ray curable resin composition for shaping from the surface of the mold.