再颁专利
- 专利标题： Housing for containing a fragile element such as a logic circuit
- 专利标题（中）： 用于容纳诸如逻辑电路之类的脆弱元件的外壳
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申请号： US230809申请日： 1994-04-21
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公开(公告)号： USRE36208E公开(公告)日： 1999-05-11
- 发明人: Francis Steffen
- 申请人： Francis Steffen
- 申请人地址： FRX Saint Genis
- 专利权人： SGS-Thomson Microelectronics S.A.
- 当前专利权人： SGS-Thomson Microelectronics S.A.
- 当前专利权人地址： FRX Saint Genis
- 优先权： FRX8800462 19880113
- 主分类号： B65D85/57
- IPC分类号： B65D85/57 ; B29C65/08 ; B42D15/10 ; G06K19/077 ; G09F1/10 ; H01L21/50 ; H05K5/00 ; H05K1/14
摘要：
A housing designed to contain a logic circuit (15) comprising two shells (11a, 11b) each including a welding area (17a, 17b) having an appropriate geometry permitting ultrasonic welding, such that when both shells are assembled before a welding phase, they are shifted along a vertical axis (20). The supporting plate (13) comprises a mounting ear (23) while the shells comprise a receptacle (33a, 33b). During the welding phase, there is no concomitant contact between any of the upper face (26) and lower face (27) of the ear (23) and the corresponding bearing faces (34a, 34b) of the receptacles, owing to a shift (21). The shift is reduced and the concomitant contact takes place between the bearing faces (34a, 34b) of the receptacles and each of the upper and lower faces (26, 27) of the ear (23) only when the welding phase is completed.
公开/授权文献
- US4931205A Tertiary thiol ethoxylate compositions 公开/授权日：1990-06-05
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