再颁专利
- 专利标题: Method of making semiconductor package with heat spreader
- 专利标题(中): 用散热器制造半导体封装的方法
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申请号: US10934632申请日: 2004-09-03
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公开(公告)号: USRE39957E1公开(公告)日: 2007-12-25
- 发明人: Chien-Ping Huang , Tzong-Da Ho , Cheng-Hsu Hsiao
- 申请人: Chien-Ping Huang , Tzong-Da Ho , Cheng-Hsu Hsiao
- 申请人地址: TW Tantzu, Taichung
- 专利权人: Siliconware Precision Industries Co., Ltd.
- 当前专利权人: Siliconware Precision Industries Co., Ltd.
- 当前专利权人地址: TW Tantzu, Taichung
- 优先权: TW90119294 20010808
- 主分类号: H01C21/66
- IPC分类号: H01C21/66 ; H01C21/00 ; H01L21/44 ; H01L23/28 ; H01L25/29 ; H01L23/48 ; H01L23/34 ; H01L23/10
摘要:
A method is provided of making a semiconductor package with a heat spreader in which a chip carrier module plate consisting of a plurality of array-arranged chip carriers is mounted with at least one chip on each of the chip carriers. A heat spreader module plate is attached to the chips, with an interface layer formed on a top surface of the heat spreader module plate. The chip carrier module plate, the chips and the heat spreader module plate are encapsulated. Adhesion force between the interface layer and the encapsulant is larger than that between the interface layer and the heat spreader module plate, and adhesion force between the interface layer and the heat spreader module plate is smaller than that between the heat spreader module plate and the encapsulant.