公开(公告)号：US6080595A

公开(公告)日：2000-06-27

申请号：US252940

申请日：1999-02-19

申请人： Kim Li

发明人： Kim Li

IPC分类号： G01R31/26 ,  G02B27/00 ,  H01C21/66

CPC分类号： G01B21/08 ,  H01C17/00

摘要： A method for estimating the thickness of a desired layer coated on a wafer includes steps of (a) forming a plurality of compared layers having the same composition of the desired layer, (b) measuring the thickness of each of the plurality of compared layers, (c) estimating a factor affecting the thickness due to a solid content in the plurality of compared layers according to the thickness of the plurality of compared layers, and (d) calculating the thickness of the desired layer coated on the wafer by introducing the factor. The desired layer is a photoresist layer formed by a spin coater. The plurality of compared layers in the step (a) are formed at different spinning rates of the spin coater. The factor is estimated by a linear regression method, and the linear regression method is used to obtain an equation representing the relation between the thickness of the plurality of compared layers and each corresponding spinning rate. The equation is ##EQU1## where w is the each spinning rate, t is the thickness of each compared layer, A is a constant, and B is the factor.

摘要翻译： 用于估计涂覆在晶片上的期望层的厚度的方法包括以下步骤：（a）形成具有相同组成的所需层的多个比较层，（b）测量多个比较层中的每一个的厚度， （c）根据多个比较层的厚度，估计由于多个比较层中的固体含量而影响厚度的因素，以及（d）通过引入因子来计算涂覆在晶片上的所需层的厚度 。 期望的层是由旋涂机形成的光致抗蚀剂层。 步骤（a）中的多个比较层形成在旋转涂布机的不同纺丝速度下。 该因子通过线性回归方法估计，并且使用线性回归方法来获得表示多个比较层的厚度与每个相应纺丝速率之间的关系的方程式。 方程式是其中w是每个纺丝速度，t是每个比较层的厚度，A是常数，B是因子。

公开(公告)号：USRE39957E1

公开(公告)日：2007-12-25

申请号：US10934632

申请日：2004-09-03

申请人： Chien-Ping Huang ,  Tzong-Da Ho ,  Cheng-Hsu Hsiao

发明人： Chien-Ping Huang ,  Tzong-Da Ho ,  Cheng-Hsu Hsiao

IPC分类号： H01C21/66 ,  H01C21/00 ,  H01L21/44 ,  H01L23/28 ,  H01L25/29 ,  H01L23/48 ,  H01L23/34 ,  H01L23/10

CPC分类号： H01L23/49816 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/4334 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/92147 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0401

摘要： A method is provided of making a semiconductor package with a heat spreader in which a chip carrier module plate consisting of a plurality of array-arranged chip carriers is mounted with at least one chip on each of the chip carriers. A heat spreader module plate is attached to the chips, with an interface layer formed on a top surface of the heat spreader module plate. The chip carrier module plate, the chips and the heat spreader module plate are encapsulated. Adhesion force between the interface layer and the encapsulant is larger than that between the interface layer and the heat spreader module plate, and adhesion force between the interface layer and the heat spreader module plate is smaller than that between the heat spreader module plate and the encapsulant.

摘要翻译： 提供了一种制造具有散热器的半导体封装的方法，其中由多个阵列布置的芯片载体组成的芯片载体模块板在每个芯片载体上安装有至少一个芯片。 散热器模块板附接到芯片，其中界面层形成在散热器模块板的顶表面上。 芯片载体模块板，芯片和散热器模块板被封装。 界面层与密封剂之间的粘附力大于界面层与散热器模块板之间的粘合力，界面层与散热器模块板之间的粘合力小于散热器模块板与密封剂之间的粘附力 。