公开(公告)号：US07001796B2

公开(公告)日：2006-02-21

申请号：US10875318

申请日：2004-06-25

申请人： Heung Lyul Cho ,  Seung Hee Nam ,  Jae Young Oh

发明人： Heung Lyul Cho ,  Seung Hee Nam ,  Jae Young Oh

IPC分类号： H01C21/00

CPC分类号： H01L27/1288 ,  H01L27/1214 ,  H01L27/124

摘要： An array substrate of a liquid crystal display (LCD) device and a method for fabricating the same is disclosed, to decrease the unit cost and time of fabrication by decreasing the usage count of mask, which includes simultaneously forming a gate line, a gate electrode and a pixel electrode on a substrate; depositing a gate insulating layer and an active layer on an entire surface of the substrate including the gate line; patterning the gate insulating layer and the active layer to remain on the gate line and the gate electrode; selectively removing the active layer above the gate line; forming a data line perpendicular to the gate line and source/drain electrodes; and depositing a passivation layer on the entire surface of the substrate including the data line.

摘要翻译： 公开了一种液晶显示器（LCD）器件的阵列基板及其制造方法，通过减少包括同时形成栅极线的掩模的使用次数来减小制造的单位成本和时间，栅电极 和基板上的像素电极; 在包括栅极线的基板的整个表面上沉积栅极绝缘层和有源层; 图案化栅极绝缘层和有源层以保留在栅极线和栅电极上; 选择性地去除栅极线上方的有源层; 形成垂直于栅极线和源极/漏极的数据线; 以及在包括所述数据线的所述衬底的整个表面上沉积钝化层。

公开(公告)号：USRE39957E1

公开(公告)日：2007-12-25

申请号：US10934632

申请日：2004-09-03

申请人： Chien-Ping Huang ,  Tzong-Da Ho ,  Cheng-Hsu Hsiao

发明人： Chien-Ping Huang ,  Tzong-Da Ho ,  Cheng-Hsu Hsiao

IPC分类号： H01C21/66 ,  H01C21/00 ,  H01L21/44 ,  H01L23/28 ,  H01L25/29 ,  H01L23/48 ,  H01L23/34 ,  H01L23/10

CPC分类号： H01L23/49816 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/4334 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/92147 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0401

摘要： A method is provided of making a semiconductor package with a heat spreader in which a chip carrier module plate consisting of a plurality of array-arranged chip carriers is mounted with at least one chip on each of the chip carriers. A heat spreader module plate is attached to the chips, with an interface layer formed on a top surface of the heat spreader module plate. The chip carrier module plate, the chips and the heat spreader module plate are encapsulated. Adhesion force between the interface layer and the encapsulant is larger than that between the interface layer and the heat spreader module plate, and adhesion force between the interface layer and the heat spreader module plate is smaller than that between the heat spreader module plate and the encapsulant.

摘要翻译： 提供了一种制造具有散热器的半导体封装的方法，其中由多个阵列布置的芯片载体组成的芯片载体模块板在每个芯片载体上安装有至少一个芯片。 散热器模块板附接到芯片，其中界面层形成在散热器模块板的顶表面上。 芯片载体模块板，芯片和散热器模块板被封装。 界面层与密封剂之间的粘附力大于界面层与散热器模块板之间的粘合力，界面层与散热器模块板之间的粘合力小于散热器模块板与密封剂之间的粘附力 。