再颁专利
- 专利标题: Surface acoustic wave device and method of fabricating the same
- 专利标题(中): 表面声波装置及其制造方法
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申请号: US12276319申请日: 2008-11-22
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公开(公告)号: USRE45419E1公开(公告)日: 2015-03-17
- 发明人: Osamu Kawachi , Osamu Ikata , Masanori Ueda , Suguru Warashina
- 申请人: Osamu Kawachi , Osamu Ikata , Masanori Ueda , Suguru Warashina
- 申请人地址: JP Tokyo
- 专利权人: Taiyo Yuden Co., Ltd.
- 当前专利权人: Taiyo Yuden Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Arent Fox LLP
- 优先权: JP2003-096577 20030331
- 主分类号: H03H9/72
- IPC分类号: H03H9/72 ; H03H9/64 ; H03H3/08 ; H03H9/54
摘要:
A surface acoustic wave device includes a piezoelectric substrate having a first surface on which comb-like electrodes, first pads connected thereto, and a first film are provided. The first film is located so as to surround the comb-like electrodes. A base substrate has a second surface on which second pads joined to the first pads and a second film joined to the first film are provided. The first and second films joined by a surface activation process define a cavity in which the comb-like electrodes and the first and second pads are hermetically sealed.