摘要:
A surface acoustic wave device includes a piezoelectric substrate having a first surface on which comb-like electrodes, first pads connected thereto, and a first film are provided. The first film is located so as to surround the comb-like electrodes. A base substrate has a second surface on which second pads joined to the first pads and a second film joined to the first film are provided. The first and second films joined by a surface activation process define a cavity in which the comb-like electrodes and the first and second pads are hermetically sealed.
摘要:
An acoustic wave device includes a substrate, a device chip that has a piezoelectric substrate and is flip-chip mounted on a surface of the substrate, a first insulation layer that has a dielectric constant lower than that of the piezoelectric substrate and is provided on a surface of the device chip opposite to another surface that faces the substrate, and a metal seal part that seals the device chip.
摘要:
Surface acoustic wave (SAW) filter includes SAW resonators, a discharge induction pattern is provided between a ground and at least one of a signal input terminal and a signal output terminal, and the discharge induction pattern has multiple gaps that are narrower than gaps that exist inside electrode patterns of the SAW resonators. Since the discharge induction pattern has multiple gaps that are narrower than gaps that exist inside electrode patterns of the SAW resonators, it is possible to induce the electrostatic discharge without fault. The multiple gaps are provided so as to protect the SAW resonators against multiple times of electrostatic discharge.
摘要:
A package substrate includes signal pads provided on a main surface of the package substrate, footpads provided on a backside of the package substrate, and a sealing electrode provided on the main surface to surround the signal pads, the signal pads being electrically coupled to the footpads, the sealing electrode being insulated from the footpads.
摘要:
A surface acoustic wave device includes: interdigital transducers; first electrode pads that are connected to the interdigital transducers through wire patterns; and a piezoelectric substrate on which the interdigital transducers, the first electrode pads, and the wire patterns, are formed. In this surface acoustic wave device, at least one of the first electrode pads is not connected to a ground pattern, and the piezoelectric substrate has a conductivity in the range of 10−12/Ω·cm to 10−6/Ω·cm.
摘要:
Efficient transverse energy confinement, and provision of a surface acoustic wave filter having preferable characteristics of both insertion loss and shape factor are obtained. In the surface acoustic wave filter, electrode fingers of one comb electrode are laid in a state of being inserted to the electrode fingers of the other comb electrode, and a thick film thicker than each plurality of electrode fingers is produced in a partial area of the bus bar, and a tip gap is provided between the top of each plurality of electrode fingers and the end face of the opposed bus bar, with a distance therebetween set not greater than 0.2λ (where, λ is one period of the comb electrode).
摘要:
The present invention permits further miniaturization and shortening of a surface acoustic wave device while avoiding the influence of the surface acoustic wave device on the inductance value and performance index (Q value) of the spiral inductor. The chip on which the spiral inductor is formed is flip-chip mounted in a package together with another surface acoustic wave device chip. The package is provided with a hermetically sealed lid. A conductor pattern is formed on a face of the package that opposes the spiral inductor. Further, the overlap between the region of the spiral inductor and the conductor pattern is 7% or less.
摘要:
A surface acoustic wave device includes: a substrate; a pair of reflection electrodes that are formed on the substrate; and drive electrodes that are interposed between the reflection electrodes. In this surface acoustic wave device, the pitches in each of the reflection electrodes vary according to a predetermined variation pattern. With this structure, the suppression on spurious signals and the shape factor (the sharpness of the cut-off region of the pass band) can be improved at the same time.
摘要:
The present invention permits further miniaturization and shortening of a surface acoustic wave device while avoiding the influence of the surface acoustic wave device on the inductance value and performance index (Q value) of the spiral inductor. The chip on which the spiral inductor is formed is flip-chip mounted in a package together with another surface acoustic wave device chip. The package is provided with a hermetically sealed lid. A conductor pattern is formed on a face of the package that opposes the spiral inductor. Further, the overlap between the region of the spiral inductor and the conductor pattern is 7% or less.
摘要:
Improvement on an insertion loss, as well as phase balance, is obtained in surface acoustic wave device. In the surface acoustic wave device, when an aperture length of the electrode fingers of an interdigital transducer for input or an interdigital transducer for output is defined as X, the interdigital transducer for input or the interdigital transducer for output includes two split interdigital transducers respectively including electrode fingers having an aperture length of approximately X/2, and electrodes of respective electrode fingers in the first and second split interdigital transducers are extracted from the two split interdigital transducers, and disposed in such a way as signals in the two outputs or inputs connected to a balanced terminal pair have a phase difference of 180°, and the two split interdigital transducers are connected in series by a common electrode of solid shape, of which electrode width is greater than twice the pitch of the electrode fingers in the two split interdigital transducers, and further the common electrode is connected to the ground potential.