Reissue Patent
- Patent Title: Mounting module and antenna apparatus
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Application No.: US16713500Application Date: 2019-12-13
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Publication No.: USRE49261E1Publication Date: 2022-10-25
- Inventor: Se Min Jin , Min Hoon Kim , Eun Kyoung Kim , Seung Goo Jang , Hyung Geun Ji , Jae Hyun Chang
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2015-0037317 20150318
- Main IPC: H01Q1/22
- IPC: H01Q1/22 ; H01Q9/06 ; H01Q21/06 ; H01Q21/28 ; H01Q21/00

Abstract:
Disclosed is a mounting module, an antenna apparatus, and a method of manufacturing a mounting module. The mounting module includes a board; an antenna mounted on a first surface of the board, an RF circuit unit mounted on a second surface of the board, and a feeding line to electrically connect the RF circuit unit and the antenna through the board, thereby reducing a loss of signal power.
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