公开(公告)号：US11437295B2

公开(公告)日：2022-09-06

申请号：US16823791

申请日：2020-03-19

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Tae Hyun Kim ,  Jung Hyun Lim ,  Seung Goo Jang ,  Eun Kyoung Kim ,  Se Min Jin

IPC: H01L23/367 ,  H01L23/31 ,  H01L23/433 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00 ,  H01L23/66

Abstract: A semiconductor package includes a substrate including an antenna; a heating element disposed on a first surface of the substrate and connected to the antenna; a heat radiating part coupled to the heating element; and a signal transfer part disposed on the first surface of the substrate and configured to electrically connect the substrate to a main substrate. The heat radiating part may include a heat transfer part connected to the heating element and heat radiating terminals connecting the heat transfer part and the main substrate to each other.

公开(公告)号：US09923261B2

公开(公告)日：2018-03-20

申请号：US14992231

申请日：2016-01-11

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Se Min Jin ,  Min Hoon Kim ,  Eun Kyoung Kim ,  Seung Goo Jang ,  Hyung Geun Ji ,  Jae Hyun Chang

IPC: H01Q1/22 ,  H01Q9/06 ,  H01Q21/06 ,  H01Q21/28 ,  H01Q21/00

CPC classification number: H01Q1/2283 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01Q9/065 ,  H01Q21/0075 ,  H01Q21/065 ,  H01Q21/28

Abstract: Disclosed is a mounting module, an antenna apparatus, and a method of manufacturing a mounting module. The mounting module includes a board; an antenna mounted on a first surface of the board, an RF circuit unit mounted on a second surface of the board, and a feeding line to electrically connect the RF circuit unit and the antenna through the board, thereby reducing a loss of signal power.

公开(公告)号：US11532894B2

公开(公告)日：2022-12-20

申请号：US16735994

申请日：2020-01-07

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Sang Hyun Kim ,  Hyung Geun Ji ,  Se Min Jin ,  Won Cheol Lee

IPC: H01Q21/06 ,  H01Q21/00 ,  H01Q1/48

Abstract: An antenna apparatus includes a patch antenna pattern; a feed via electrically connected to the patch antenna pattern at a point offset in a first direction from a center of the patch antenna pattern; a first side coupling pattern spaced apart from the patch antenna pattern along a second direction and a second side coupling pattern spaced apart from the patch antenna pattern along the second direction and opposite to the first side coupling pattern; and a first side ground pattern spaced apart from the patch antenna pattern along the first direction and a second side ground pattern spaced apart from the patch antenna pattern along the first direction and opposite to the first side ground pattern. The patch antenna pattern and the first and second side coupling patterns are disposed between the first and second side ground patterns with respect to the first direction.

公开(公告)号：USRE49261E1

公开(公告)日：2022-10-25

申请号：US16713500

申请日：2019-12-13

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Se Min Jin ,  Min Hoon Kim ,  Eun Kyoung Kim ,  Seung Goo Jang ,  Hyung Geun Ji ,  Jae Hyun Chang

IPC: H01Q1/22 ,  H01Q9/06 ,  H01Q21/06 ,  H01Q21/28 ,  H01Q21/00

Abstract: Disclosed is a mounting module, an antenna apparatus, and a method of manufacturing a mounting module. The mounting module includes a board; an antenna mounted on a first surface of the board, an RF circuit unit mounted on a second surface of the board, and a feeding line to electrically connect the RF circuit unit and the antenna through the board, thereby reducing a loss of signal power.

公开(公告)号：US20190057924A1

公开(公告)日：2019-02-21

申请号：US15832807

申请日：2017-12-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae Hyun Kim ,  Jung Hyun Lim ,  Seung Goo Jang ,  Eun Kyoung Kim ,  Se Min Jin

IPC: H01L23/367 ,  H01L23/31 ,  H01L23/00

Abstract: A semiconductor package includes a substrate including an antenna; a heating element disposed on a first surface of the substrate and connected to the antenna; a heat radiating part coupled to the heating element; and a signal transfer part disposed on the first surface of the substrate and configured to electrically connect the substrate to a main substrate. The heat radiating part may include a heat transfer part connected to the heating element and heat radiating terminals connecting the heat transfer part and the main substrate to each other.