A method and apparatus for interconnecting electronic circuits (104) using nearly pure soft annealed gold mechanically compressed within through-plated holes (111). The invention has its application in attaching integrated circuit dice (104) directly to circuit boards (110) by ball bonding gold wires (101) to the bonding pads (105) of the integrated circuit dice (104) in a substantially perpendicular relationship to the surfaces of the dice (104) and inserting the gold leads (101) into through-plated holes (111) of circuit boards (110) which provide an electrical and a mechanical connection once the leads (101) are compressed within the through-plated holes (111). The present invention also finds its application in the interconnection of sandwiched circuit board assemblies (200) where soft gold lead wires are inserted into axially aligned through-plated holes of the circuit boards (212, 214, 216, 217, 219, 221) and compressed so that the gold lead wires compress and buckle within the through-plated holes, forming an electrical connection between the circuit boards (212, 214, 216, 217, 219, 221).