公开(公告)号：WO8809599A3

公开(公告)日：1988-12-29

申请号：PCT/US8801668

申请日：1988-05-16

Applicant: CRAY RESEARCH INC

Inventor： CRAY SEYMOUR R ,  KRAJEWSKY NICHOLAS J

IPC: H01L21/48 ,  H01L21/60 ,  H01L21/607 ,  H01L23/50 ,  H01R12/52 ,  H05K3/30 ,  H05K3/32 ,  H05K3/36 ,  H01R9/09

CPC classification number: H01L24/11 ,  H01L21/4853 ,  H01L2224/05644 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/45144 ,  H01L2224/4943 ,  H01L2224/78301 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2225/06596 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12033 ,  H01L2924/14 ,  H01R12/523 ,  H05K3/308 ,  H05K3/328 ,  H05K3/368 ,  H05K2201/096 ,  H05K2201/1059 ,  H05K2201/10825 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K2203/0495 ,  Y10T29/49135 ,  Y10T29/4914 ,  Y10T29/49153 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/48

Abstract: A method and apparatus for interconnecting electronic circuits (104) using nearly pure soft annealed gold mechanically compressed within through-plated holes (111). The invention has its application in attaching integrated circuit dice (104) directly to circuit boards (110) by ball bonding gold wires (101) to the bonding pads (105) of the integrated circuit dice (104) in a substantially perpendicular relationship to the surfaces of the dice (104) and inserting the gold leads (101) into through-plated holes (111) of circuit boards (110) which provide an electrical and a mechanical connection once the leads (101) are compressed within the through-plated holes (111). The present invention also finds its application in the interconnection of sandwiched circuit board assemblies (200) where soft gold lead wires are inserted into axially aligned through-plated holes of the circuit boards (212, 214, 216, 217, 219, 221) and compressed so that the gold lead wires compress and buckle within the through-plated holes, forming an electrical connection between the circuit boards (212, 214, 216, 217, 219, 221).

Abstract translation: 一种使用几乎纯粹的软退火金在互穿电镀孔内机械压缩的互连电子电路的方法和装置。 本发明的应用是将集成电路小片直接连接到电路板，方法是将金线球焊到集成电路小片的焊盘上，使其与小片表面基本垂直，并将金导线插入到 一旦引线在贯通的镀孔内被压缩，电路板提供电连接和机械连接。 本发明还发现其应用于夹层电路板组件的互连，其中软金引线被插入电路板的轴向对齐的通孔电镀孔中并且被压缩，使得保持引线在通孔电镀孔内压缩和弯曲 ，在电路板之间形成电连接。