BALL ARRANGING SUBSTRATE FOR FORMING BUMP, BALL ARRANGING HEAD, BALL ARRANGING DEVICE, AND BALL ARRANGING METHOD

Invention Application

WO1998034273A1 BALL ARRANGING SUBSTRATE FOR FORMING BUMP, BALL ARRANGING HEAD, BALL ARRANGING DEVICE, AND BALL ARRANGING METHOD 审中-公开

Title translation: 球形安装基座用于形成BUMP，球安装头，球安装装置和球安装方法

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Patent Title: BALL ARRANGING SUBSTRATE FOR FORMING BUMP, BALL ARRANGING HEAD, BALL ARRANGING DEVICE, AND BALL ARRANGING METHOD
Patent Title (中): 球形安装基座用于形成BUMP，球安装头，球安装装置和球安装方法
Application No.: PCT/JP1997003011

Application Date: 1997-08-28
Publication No.: WO1998034273A1

Publication Date: 1998-08-06
Inventor: NIPPON STEEL CORPORATION
Applicant: NIPPON STEEL CORPORATION , SHIMOKAWA, Kenji , HASHINO, Eiji , TATSUMI, Kohei
Assignee: NIPPON STEEL CORPORATION,SHIMOKAWA, Kenji,HASHINO, Eiji,TATSUMI, Kohei
Current Assignee: NIPPON STEEL CORPORATION,SHIMOKAWA, Kenji,HASHINO, Eiji,TATSUMI, Kohei
Priority: JP9/31274 19970130; JP9/105309 19970408
Main IPC: H01L21/321
IPC: H01L21/321

BALL ARRANGING SUBSTRATE FOR FORMING BUMP, BALL ARRANGING HEAD, BALL ARRANGING DEVICE, AND BALL ARRANGING METHOD

Abstract:

A ball arranging substrate is provided with a substrate having a main surface and a plurality of arranging holes for holding fine conductive balls by suction formed on the main surface at the positions corresponding to the electrodes of a semiconductor element, circuit board, etc. At the time of optically discriminating the normal/abnormal condition of the arranging state of the fine conductive balls from the light reflected from the ball arranging surface of the substrate on which the balls are held by suction by irradiating the ball arranging surface with light, the wavelength of the irradiating light is set within the range of 300-900 nm and, at the same time, the reflectance of the ball arranging surface to the light is set at

Abstract(Chinese):

球排列基板具有基板，该基板具有主表面和多个用于在与半导体元件，电路板等的电极对应的位置处的主表面上形成的吸引保持微小导电球的排列孔。在通过用光照射球排列表面，通过抽吸来光学地鉴别导电球的布置状态的正常/异常状况与通过吸力保持球的基底的球排列表面反射的光，波长将照射光设定在300-900nm的范围内，同时将球排列面对光的反射率设定为<50％。然而，当布置基板具有透光性时，通过将反射镜定位在与基板相反的一侧上的光源来测量反射率。

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Global Dossier Patent Scope Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02	.半导体器件或其部件的制造或处理
H01L21/04	..至少具有一个跃变势垒或表面势垒的器件，例如PN结、耗尽层、载体集结层
H01L21/18	...器件有由周期表Ⅳ族元素或含有/不含有杂质的AⅢBⅤ族化合物构成的半导体，如掺杂材料
H01L21/30	....用H01L21/20至H01L21/26各组不包含的方法或设备处理半导体材料的（在半导体材料上制作电极的入H01L21/28）
H01L21/31	.....在半导体材料上形成绝缘层的，例如用于掩膜的或应用光刻技术的（密封层入H01L21/56）；以及这些层的后处理；这些层的材料的选择
H01L21/3205	......非绝缘层的沉积，例如绝缘层上的导电层或电阻层；这些层的后处理（电极的制造入H01L21/28）
H01L21/321	.......后处理