A cooling system for a die carrier includes a cooling fan (742) disposed at a substantial distance from the semiconductor die carrier and a cooling duct (744) including an inlet portion (752) and an outlet portion (754). The cooling duct inlet portion (752) is attached to the cooling fan (742) and a heat exchanger (746) is disposed on an upper surface of the semiconductor die carrier (730). The cooling duct outlet portion (754) is disposed in close proximity to the heat exchanger (746) such that the cooling fan (742) draws ambient air into the cooling duct (744) and the ambient air exists the cooling duct outlet portion (754) and passes in a heat exchanger relationship with the heat exchanger (746).