公开(公告)号：WO9926460A8

公开(公告)日：1999-07-01

申请号：PCT/US9824251

申请日：1998-11-13

Applicant: PANDA PROJECT

Inventor： CRANE STANFORD W JR ,  KRISHNAPURA LAKSHMINARASIMHA ,  BEHAR MOISES ,  DUTTA ARINDUM ,  LINK KEVIN J ,  AHERN WILLIAM

IPC: H01L23/36 ,  H01L23/467 ,  H05K7/20

CPC classification number: H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A cooling system for a die carrier includes a cooling fan (742) disposed at a substantial distance from the semiconductor die carrier and a cooling duct (744) including an inlet portion (752) and an outlet portion (754). The cooling duct inlet portion (752) is attached to the cooling fan (742) and a heat exchanger (746) is disposed on an upper surface of the semiconductor die carrier (730). The cooling duct outlet portion (754) is disposed in close proximity to the heat exchanger (746) such that the cooling fan (742) draws ambient air into the cooling duct (744) and the ambient air exists the cooling duct outlet portion (754) and passes in a heat exchanger relationship with the heat exchanger (746).

Abstract translation: 用于模具载体的冷却系统包括设置在距离半导体管芯载体相当远的冷却风扇（742）和包括入口部分（752）和出口部分（754）的冷却管道（744）。 冷却管道入口部分（752）附接到冷却风扇（742），并且热交换器（746）设置在半导体管芯载体（730）的上表面上。 冷却管出口部分（754）设置在热交换器（746）附近，使得冷却风扇（742）将环境空气吸入冷却管道（744），并且环境空气存在于冷却管道出口部分（754） ）并与热交换器（746）的热交换器关系通过。

公开(公告)号：WO9524729A3

公开(公告)日：1996-05-02

申请号：PCT/US9502676

申请日：1995-03-09

Applicant: PANDA PROJECT

Inventor： CRANE STANFORD W JR ,  PORTUONDO MARIA M ,  ERICKSON WILLARD ,  BIZZARRI MAURICE

IPC: G06F1/18 ,  G06F13/00 ,  G06F13/14 ,  G06F13/40 ,  G06F15/00 ,  G06F15/76 ,  G06F15/78 ,  H01R12/50 ,  H01R33/00 ,  H05K1/00 ,  H05K1/14 ,  H05K7/10 ,  H05K7/14 ,  H05K7/18 ,  H01L

CPC classification number: G06F1/185 ,  G06F1/184 ,  G06F1/186 ,  G06F13/4045 ,  G06F13/409 ,  H01R12/57 ,  H01R12/58 ,  H01R12/737 ,  H05K1/0286 ,  H05K1/14 ,  H05K7/1084 ,  H05K7/1441 ,  H05K7/1442 ,  H05K7/1444 ,  H05K7/1445

Abstract: A computeur system architecture in which functionally compatible electronic components are located on modular printed circuit boards. Thus, a type of processor used by the system can be changed by replacing the printed circuit board incorporating the processor. Similarly, a type of peripheral bus used can be changed simply by replacing the printed circuit board containing the peripheral controller. High-density connectors connect the circuit boards. Some embodiments of the invention use a single backplane. Other embodiments place peripheral slots on a second, passive backplane.

公开(公告)号：WO9524730A3

公开(公告)日：1996-02-15

申请号：PCT/US9502678

申请日：1995-03-09

Applicant: PANDA PROJECT

Inventor： CRANE STANFORD W JR ,  PORTUONDO MARIA M

IPC: H05K1/18 ,  H01L23/498 ,  H05K1/11 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/46 ,  H01L

CPC classification number: H01L23/49861 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/181 ,  H05K1/112 ,  H05K3/308 ,  H05K3/321 ,  H05K3/3421 ,  H05K3/4623 ,  H05K2201/09472 ,  H05K2201/09536 ,  H05K2201/09645 ,  H05K2201/10189 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10704 ,  H05K2201/10772 ,  H05K2201/10893 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An apparatus comprising a multi-layer substrate (10) including a plurality of layers of insulative material (12), at least one well (15) formed in at least one of the layers, the well (15) extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component (13) formed within the well (15) on the inner surface of the multi-layer substrate; and a device having at least one electrically conductive lead or wire (11) extending into the well (15) and being in direct physical contact with the electrically conductive component (13) formed on the inner surface of the multi-layer substrate. Also, a method of manufacturing an apparatus comprising the steps of forming a multi-layer substrate (10) including a plurality of layers of insulative material (12), at least one well (15) formed in at least one of the layers, the well (15) extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component (13) formed within the well (15) on the inner surface of the multi-layer substrate; and extending at least one electrically conductive lead or wire (11) from a device into the well (15) such that the lead or wire is in direct physical contact with the electrically conductive component (13) formed on the inner surface of the multi-layer substrate.

Abstract translation: 半导体管芯封装（30）包括多个导电引线（11）和用于承载电信号的多层结构（10），所述多层结构（10）包括多层绝缘材料（12a-12d ），每个层包括在该层的相对侧上的第一表面和第二表面。 每个引线（11）延伸到完全延伸通过至少一个层的相应的阱（15），并且在一个层的一个表面上底部，阱（15）不通过该表面延伸并电耦合 涉及形成在其对应的井（15）内的导电接合结构（13）。

公开(公告)号：WO9926158B1

公开(公告)日：1999-07-08

申请号：PCT/US9824253

申请日：1998-11-13

Applicant: PANDA PROJECT

Inventor： CRANE STANFORD W JR ,  KRISHNAPURA LAKSHMINARASIMHA ,  FUOCO DANIEL ,  LEE ROY K ,  LINK KEVIN J ,  BEHAR MOISES ,  DUTTA ARINDUM ,  CROSS WILLIAM

IPC: G06F1/18 ,  G06F1/16 ,  G06F13/40 ,  H05K7/14

CPC classification number: G06F13/409

Abstract: A computer system includes a bus system; a pluggable central processing unit circuit board, coupled to the bus system; a pluggable logic board coupled to the pluggable central processing unit circuit board through the bus system; a pluggable input/output board coupled to the pluggable logic board through the bus system; a first connector unit for directly connecting the pluggable central processing unit circuit board to a first predetermined location on the pluggable logic board; and a second connector unit for directly connecting the pluggable logic board to a predetermined location on the pluggable input/output board.

Abstract translation: 计算机系统包括总线系统; 耦合到总线系统的可插拔中央处理单元电路板; 可插拔逻辑板，其通过总线系统耦合到可插拔中央处理单元电路板; 通过总线系统耦合到可插拔逻辑板的可插拔输入/输出板; 第一连接器单元，用于将可插拔中央处理单元电路板直接连接到可插拔逻辑板上的第一预定位置; 以及用于将可插拔逻辑板直接连接到可插拔输入/输出板上的预定位置的第二连接器单元。

公开(公告)号：WO9530945A2

公开(公告)日：1995-11-16

申请号：PCT/US9505210

申请日：1995-05-02

Applicant: PANDA PROJECT

Inventor： CRANE STANFORD W JR ,  PORTUONDO MARIA M ,  CRUZ EDWARD V ,  RAZO VINCENT R ,  FYNN SHAUN

IPC: G06F1/16 ,  G06F1/18 ,  G06F1/20 ,  H05K7/20

CPC classification number: G06F1/20 ,  G06F1/16 ,  G06F1/18 ,  G06F1/181 ,  G06F1/183 ,  G06F2200/1639

Abstract: A computer system including a plurality of air circulation areas to facilitate cooling of components within the air circulation areas. Specifically, the system includes an air circulation area for a plurality of printed circuit boards, for a power supply, and for a plurality of internal and external peripherals, such as disk drives. The system also includes an automatic door that covers the external peripherals. The external peripherals slide forward, out of a casing of the system to facilitate upgrade and/or repair of the peripherals. In addition, the system includes cabling slots and structure to effect electromagnetic interference (EMI) shielding.

Abstract translation: 一种计算机系统，包括多个空气循环区域，以便于冷却空气循环区域内的部件。 具体而言，该系统包括用于多个印刷电路板，用于电源以及多个内部和外部外围设备（例如磁盘驱动器）的空气循环区域。 该系统还包括一个覆盖外部外围设备的自动门。 外部外围设备从系统的外壳中向前滑动，以便于外围设备的升级和/或修理。 此外，该系统还包括布线槽和结构以实现电磁干扰（EMI）屏蔽。