Invention Application
- Patent Title: IMPROVEMENTS IN SEWING METHODS AND MACHINES
- Patent Title (English): Improvements in sewing methods and machines
- Patent Title (中): 缝纫方法和机器的改进
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Application No.: PCT/IL1999/000198Application Date: 1999-04-12
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Publication No.: WO99052710A1Publication Date: 1999-10-21
- Main IPC: D05B23/00
- IPC: D05B23/00 ; B05C11/10 ; B32B38/00 ; D05B1/02 ; D05B1/06 ; D05B1/10 ; D05B17/00 ; B32B31/12 ; D05B93/00
Abstract:
Sewing method, comprising bonding sewing threads (52) to themselves or to one another, or bonding fabric layers (50, 51) together, by using an adhesive (57) having an elasticity which is measured by an elongation at break of at least 10-20 %, and preferably between 50 and 150 %. A chain-stitch is formed and locked, at the points of interlocking of successive loops of its single or double threads, with a bonding adhesive, whereby to form a pseudo lock-stitch. The bonding adhesive is chosen from among polymeric adhesives that can be formed by curing a precursor by means of U.V. light, e.g. acrylate-based photo-polymers. The bonding adhesive is applied by injecting a polymerizable precursor at the point where the adhesive bond is to be produced and then polymerizing the same.
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