Invention Application
- Patent Title: ELECTROSTATIC IMPREGNATION OF POWDERS ON SUBSTRATES
- Patent Title (中): 静电浸渍基质上的粉末
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Application No.: PCT/US2001/018240Application Date: 2001-06-05
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Publication No.: WO02002245A2Publication Date: 2002-01-10
- Main IPC: B32B7/02
- IPC: B32B7/02 ; A61C15/04 ; A61L17/14 ; A61L27/54 ; A61L31/16 ; B05D1/06 ; B29B15/10 ; B32B27/00 ; D06M10/02 ; D06M10/10 ; D06M15/05 ; D06M15/09 ; D06M15/227 ; D06M15/507 ; D06M15/53 ; D06M15/693 ; D06M23/08 ; D06M101/18 ; D06M101/22 ; D06M101/32 ; D06M101/34 ; B05D
Abstract:
Electrostatic Impregnation Of Powders On SubstratesThe use of electrostatic impregnation to load materials such as binders and flavors onto substrates such as fibers and medical devices is disclosed. Substrates loaded with materials such as binders and flavors, wherein the materials are loaded on the substrates via electrostatic impregnation are also disclosed.
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