Invention Application
- Patent Title: SUBSTRATE FOR AN ELECTRIC COMPONENT AND METHOD FOR THE PRODUCTION THEREOF
- Patent Title (中): 基板用于制造电子元件和方法
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Application No.: PCT/DE0200180Application Date: 2002-01-21
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Publication No.: WO02061833A3Publication Date: 2003-06-19
- Inventor: FEIERTAG GREGOR , STELZL ALOIS , KRUEGER HANS
- Applicant: EPCOS AG , FEIERTAG GREGOR , STELZL ALOIS , KRUEGER HANS
- Assignee: EPCOS AG,FEIERTAG GREGOR,STELZL ALOIS,KRUEGER HANS
- Current Assignee: EPCOS AG,FEIERTAG GREGOR,STELZL ALOIS,KRUEGER HANS
- Priority: DE10104574 2001-02-01
- Main IPC: H01L23/12
- IPC: H01L23/12 ; H01L21/60 ; H01L23/498 ; H03H3/08 ; H03H9/10 ; H03H9/145 ; H03H9/25 ; H05K1/03 ; H05K1/11 ; H03H3/00 ; H03H9/05 ; H03H9/15
Abstract:
The aim of the invention is to use a slow dissolving ceramic substrate for components mounted according to the Flip-Clip method, particularly surface wave components, whereby multi-layered metallisations are optionally produced thereon by metal deposition. The bumps can also be produced by self-adjusting metal deposition.
Information query
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