The invention relates, inter alia, to an additional contacting (30) for a piezoelectric component (10) in the form of a multilayer structure, wherein the piezoelectric component (10) is formed by a stack (16) of alternatingly arranged piezoelectric ceramic layers (11) and electrode layers (12, 13). The additional contacting (30) has a series of connecting elements (31) for connecting a metallization (15) of the electric component (10) to an electrical connecting element (19). In order to minimize mechanical loads during dynamic operation of the piezoelectric component (10), the additional contacting (30) is configured as an individual, structured component (32), especially in the form of a structured foil. Said structured foil (32) advantageously has a current conduction path (33) which is common to the connecting elements (31) and a contacting zone formed in the area of static base plate (17), wherein the additional contacting (30) is connected to the electrical connecting element (19) in the area of said contacting zone (34).