Invention Application
- Patent Title: APPARATUS AND METHOD FOR MOUNTING ELECTRONIC PARTS
- Patent Title (中): 安装电子部件的装置和方法
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Application No.: PCT/JP2002/008077Application Date: 2002-08-07
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Publication No.: WO2003015491A1Publication Date: 2003-02-20
- Inventor: HIDESE, Wataru , NAKASHIMA, Tosiaki , HAJI, Hiroshi
- Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Applicant Address: 1006, Oaza Kadoma, Kadoma-shi, Osaka 571-0050 JP
- Assignee: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Current Assignee: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Current Assignee Address: 1006, Oaza Kadoma, Kadoma-shi, Osaka 571-0050 JP
- Agency: OGURI, Shohei
- Priority: JP2001-240820 20010808; JP2001-240821 20010808
- Main IPC: H05K13/08
- IPC: H05K13/08
Abstract:
[Problem] To provide an electronic parts mount apparatus and an electronic parts mount method capable of efficiently mounting electronic parts on a board. [Solution means] An electronic parts mount apparatus for taking out electronic parts from a parts supply section 3 by a transfer head (9) and transporting and mounting the electronic parts to and on a board (2) has a board recognition camera (15) moving independently of the transfer head (9) and advancing to and retreating from the board (2) positioned on a transfer passage (1) for picking up an image of the board (2) to detect the position thereof. The image pickup step of the board (2) by the board recognition camera (15) and the parts taking out step in the parts supply section by the transfer head (9) are performed concurrently. Thus, the tact time can be shortened and the electronic parts can be mounted on the board efficiently.
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