公开(公告)号：WO2006078068A2

公开(公告)日：2006-07-27

申请号：PCT/JP2006/301267

申请日：2006-01-20

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. ,  KIHARA, Masahiro ,  INOUE, Masafumi ,  HIDESE, Wataru

Inventor： KIHARA, Masahiro ,  INOUE, Masafumi ,  HIDESE, Wataru

IPC: H05K13/08

CPC classification number: H05K13/0413 ,  H05K13/0069 ,  Y10T29/49004 ,  Y10T29/53174

Abstract: To provide an electronic component mounting system and an electronic component mounting method which can prevent a mounting failure due to positional error in a height direction of a substrate and ensure mounting quality. The electronic component mounting system includes a plurality of electronic component mounting devices connected to one another and mounts an electronic component on a substrate to manufacture a mounting substrate. A print test device for testing the substrate after solder printing measures a height position of a height measurement point set on the upper surface of the substrate 4 by a height measuring machine 22 and outputs a measurement result as substrate height data. In a component placing step using an electronic component placing device, a control parameter for controlling a component placing operation of the placing head 32 is updated. Accordingly, it is possible to correct a variation of the height position of an individual substrate and to prevent a mounting failure due to positional error in the height direction of the substrate.

Abstract translation: 提供一种能够防止由于基板的高度方向上的位置误差引起的安装故障并确保安装质量的电子部件安装系统和电子部件安装方法。 电子部件安装系统包括彼此连接的多个电子部件安装装置，并将电子部件安装在基板上以制造安装基板。 用于在焊接印刷之后测试基板的印刷测试装置通过高度测量机22测量设置在基板4的上表面上的高度测量点的高度位置，并输出测量结果作为基板高度数据。 在使用电子元件放置装置的元件放置步骤中，更新用于控制放置头32的元件放置操作的控制参数。 因此，可以校正单个基板的高度位置的变化，并且防止由于基板的高度方向上的位置误差引起的安装故障。

公开(公告)号：WO2003015491A1

公开(公告)日：2003-02-20

申请号：PCT/JP2002/008077

申请日：2002-08-07

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： HIDESE, Wataru ,  NAKASHIMA, Tosiaki ,  HAJI, Hiroshi

IPC: H05K13/08

CPC classification number: H01L21/67259 ,  H01L21/67144 ,  H01L21/681 ,  H05K13/0452 ,  Y10T29/49004 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/53039 ,  Y10T29/53091 ,  Y10T29/53178 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53204

Abstract: [Problem] To provide an electronic parts mount apparatus and an electronic parts mount method capable of efficiently mounting electronic parts on a board. [Solution means] An electronic parts mount apparatus for taking out electronic parts from a parts supply section 3 by a transfer head (9) and transporting and mounting the electronic parts to and on a board (2) has a board recognition camera (15) moving independently of the transfer head (9) and advancing to and retreating from the board (2) positioned on a transfer passage (1) for picking up an image of the board (2) to detect the position thereof. The image pickup step of the board (2) by the board recognition camera (15) and the parts taking out step in the parts supply section by the transfer head (9) are performed concurrently. Thus, the tact time can be shortened and the electronic parts can be mounted on the board efficiently.

Abstract translation: 本发明提供能够将电子部件有效地安装在基板上的电子部件安装装置和电子部件安装方法。 [解决方案]一种用于通过转印头（9）从零件供应部分3中取出电子部件并将电子部件运送和安装到板（2）上的电子部件安装装置具有板识别照相机（15） 独立于转印头（9）移动并且从位于转印通道（1）上的板（2）前进和后退，以拾取板（2）的图像以检测其位置。 通过板识别照相机（15）的板（2）的图像拾取步骤和由转印头（9）取出部分供给部分的部分同时进行。 因此，可以缩短生产节拍时间，并且可以有效地将电子部件安装在板上。

公开(公告)号：WO2003015489A3

公开(公告)日：2003-02-20

申请号：PCT/JP2002/008076

申请日：2002-08-07

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： HAJI, Hiroshi ,  HIDESE, Wataru

IPC: H01L21/00

Abstract: [Problem] To provide an electronic parts mount apparatus and an electronic parts mount method capable of efficiently taking out electronic parts in a wafer state and mounting the electronic parts on a board. [Solution means] An electronic parts mount apparatus for taking out semiconductor chips from a semiconductor wafer held on a wafer hold section by a transfer head comprising a plurality of suction nozzles and transporting and mounting the semiconductor chips to and on a board has a parts recognition camera disposed in a manner that it can advance to and retreat from the wafer hold section for picking up an image of the semiconductor wafer. A parts mounting step for mounting a plurality of semiconductor chips on the board by the transfer head and an image picking up step for picking up a plurality of semiconductor chips to be next taken out by the parts recognition camera are performed concurrently. Thereby, the number of electronic parts per mount turn can be increased, the tact time can be shortened, and the electronic parts can be efficiently taken out and mounted on the board.

公开(公告)号：WO2003015489A2

公开(公告)日：2003-02-20

申请号：PCT/JP2002/008076

申请日：2002-08-07

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： HAJI, Hiroshi ,  HIDESE, Wataru

IPC: H05K13/00

CPC classification number: H01L21/67259 ,  H01L21/67144 ,  H01L21/681 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/53091 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53261 ,  Y10T29/53478

Abstract: [Problem] To provide an electronic parts mount apparatus and an electronic parts mount method capable of efficiently taking out electronic parts in a wafer state and mounting the electronic parts on a board. [Solution means] An electronic parts mount apparatus for taking out semiconductor chips from a semiconductor wafer held on a wafer hold section by a transfer head comprising a plurality of suction nozzles and transporting and mounting the semiconductor chips to and on a board has a parts recognition camera disposed in a manner that it can advance to and retreat from the wafer hold section for picking up an image of the semiconductor wafer. A parts mounting step for mounting a plurality of semiconductor chips on the board by the transfer head and an image picking up step for picking up a plurality of semiconductor chips to be next taken out by the parts recognition camera are performed concurrently. Thereby, the number of electronic parts per mount turn can be increased, the tact time can be shortened, and the electronic parts can be efficiently taken out and mounted on the board.

Abstract translation: 本发明提供能够有效地取出晶片状态的电子部件并将电子部件安装在基板上的电子部件安装装置和电子部件安装方法。 [解决方案]一种电子部件安装装置，用于通过包括多个吸嘴的转印头将半导体晶片从保持在晶片保持部上的半导体晶片取出，并将半导体芯片输送并安装在板上，具有部件识别 照相机以使其能够前进到晶片保持部分并从晶片保持部分退回以拾取半导体晶片的图像的方式布置。 同时执行用于通过传送头将多个半导体芯片安装在板上的部件安装步骤和用于拾取由部件识别相机取出的多个半导体芯片的图像拾取步骤。 由此，可以提高每个安装转弯的电子部件的数量，可以缩短节拍时间，并且可以有效地将电子部件取出并安装在电路板上。