Invention Application
- Patent Title: ROOM TEMPERATURE METAL DIRECT BONDING
- Patent Title (中): 房间温度金属直接结合
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Application No.: PCT/US2004002006Application Date: 2004-02-06
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Publication No.: WO2004071700A3Publication Date: 2005-04-21
- Inventor: TONG QIN-YI , ENQUIST PAUL M , ROSE ANTHONY SCOT
- Applicant: ZIPTRONIX INC , TONG QIN-YI , ENQUIST PAUL M , ROSE ANTHONY SCOT
- Assignee: ZIPTRONIX INC,TONG QIN-YI,ENQUIST PAUL M,ROSE ANTHONY SCOT
- Current Assignee: ZIPTRONIX INC,TONG QIN-YI,ENQUIST PAUL M,ROSE ANTHONY SCOT
- Priority: US35960803 2003-02-07
- Main IPC: H01L21/60
- IPC: H01L21/60 ; H01L21/98 ; H01L21/44 ; H01L21/48 ; H01L21/50
Abstract:
A bonded device structure including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, and having a first non-metallic region adjacent to the metallic bonding pads on the first substrate, a second substrate having a second set of metallic bonding pads aligned with the first set of metallic bonding pads, preferably connected to a device or circuit, and having a second non-metallic region adjacent to the metallic bonding pads on the second substrate, and a contact-bonded interface between the first and second set of metallic bonding pads formed by contact bonding of the first non-metallic region to the second non-metallic region. At least one of the first and second substrates may be elastically deformed.
Information query
IPC分类:
