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    WAFER SCALE DIE HANDLING
    1.
    发明申请
    WAFER SCALE DIE HANDLING 审中-公开

    公开(公告)号：WO2005091868A2

    公开(公告)日：2005-10-06

    申请号：PCT/US2005/005641

    申请日：2005-02-23

    Applicant: ZIPTRONIX, INC. ,  ENQUIST, Paul, M. ,  FOUNTAIN, Gaius, G., Jr. ,  PETTEWAY, Carl, T.

    Inventor： ENQUIST, Paul, M. ,  FOUNTAIN, Gaius, G., Jr. ,  PETTEWAY, Carl, T.

    IPC: H01L23/495

    CPC classification number: H01L21/67333 ,  H01L2924/0002 ,  Y10S414/135 ,  Y10S414/14 ,  Y10S414/141 ,  H01L2924/00

    Abstract: A waffle pack device including a member having recesses in a surface of the member to accommodate die from at least one semiconductor wafer. The member is compatible with semiconductor wafer handling equipment and/or semiconductor wafer processing. Preferably, the member accommodates at least a majority of die from a semiconductor wafer. Further, one semiconductor device assembly method is provided which removes die from a singular waffle pack device, places die from the single waffle pack device on a semiconductor package to assemble from the placed die all die components required for an integrated circuit, and electrically interconnects the placed die in the semiconductor package to form the integrated circuit. Another semiconductor device assembly method is provided which removes die from at least one waffle pack device, places die from the at least one waffle pack device on a semiconductor package to assemble from the placed die device components required for an integrated circuit, and electrically interconnects the placed die in the semiconductor package to form the integrated circuit.

    Abstract translation: 一种华夫饼包装置，包括在所述构件的表面中具有凹部以容纳来自至少一个半导体晶片的模具的构件。 该元件与半导体晶片处理设备和/或半导体晶片处理兼容。 优选地，构件容纳来自半导体晶片的至少大部分管芯。 此外，提供了一种半导体器件组装方法，其从单个华夫饼包装置去除管芯，将来自单个瓦楞纸包装置的管芯放置在半导体封装上，以从放置的管芯组装集成电路所需的所有管芯部件，并将 放置在半导体封装中以形成集成电路。 提供了另一种半导体器件组装方法，其从至少一个华夫饼包装置去除管芯，将来自至少一个华夫饼包装置的管芯放置在半导体封装上，以从集成电路所需的放置的管芯器件组件中组装，并将 放置在半导体封装中以形成集成电路。

    HETEROGENEOUS ANNEALING METHOD AND DEVICE
    5.
    发明申请
    HETEROGENEOUS ANNEALING METHOD AND DEVICE 审中-公开
    异构退火方法和装置

    公开(公告)号：WO2014036407A1

    公开(公告)日：2014-03-06

    申请号：PCT/US2013/057536

    申请日：2013-08-30

    Applicant: ENQUIST, Paul, M. ,  FOUNTAIN, Gaius, Gillman, Jr.

    Inventor： ENQUIST, Paul, M. ,  FOUNTAIN, Gaius, Gillman, Jr.

    IPC: H01L21/30

    CPC classification number: H01L25/0657 ,  H01L21/2007 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/49866 ,  H01L24/32 ,  H01L24/83 ,  H01L25/50 ,  H01L2221/68359 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/83053 ,  H01L2224/83201 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A method of integrating a first substrate having a first surface with a first insulating material and a first contact structure with a second substrate having a second surface with a second insulating material and a second contact structure. The first insulating material is directly bonded to the second insulating material. A portion of the first substrate is removed to leave a remaining portion. A third substrate having a coefficient of thermal expansion (CTE) substantially the same as a CTE of the first substrate is bonded to the remaining portion. The bonded substrates are heated to facilitate electrical contact between the first and second contact structures. The third substrate is removed after heating to provided a bonded structure with reliable electrical contacts.

    Abstract translation: 一种将具有第一表面的第一衬底与第一绝缘材料和第一接触结构与具有第二表面的第二衬底与第二绝缘材料和第二接触结构集成的方法。 第一绝缘材料直接接合到第二绝缘材料上。 去除第一衬底的一部分以留下剩余部分。 具有与第一基板的CTE基本相同的热膨胀系数（CTE）的第三基板被结合到剩余部分。 粘合的基底被加热以促进第一和第二接触结构之间的电接触。 在加热之后移除第三衬底以提供具有可靠电接触的接合结构。

    WAFER SCALE DIE HANDLING
    7.
    发明申请
    WAFER SCALE DIE HANDLING 审中-公开

    公开(公告)号：WO2005091868A3

    公开(公告)日：2009-03-26

    申请号：PCT/US2005005641

    申请日：2005-02-23

    Applicant: ZIPTRONIX INC ,  ENQUIST PAUL M ,  FOUNTAIN GAIUS G JR ,  PETTEWAY CARL T

    Inventor： ENQUIST PAUL M ,  FOUNTAIN GAIUS G JR ,  PETTEWAY CARL T

    IPC: H01L23/495

    CPC classification number: H01L21/67333 ,  H01L2924/0002 ,  Y10S414/135 ,  Y10S414/14 ,  Y10S414/141 ,  H01L2924/00

    Abstract: A waffle pack device including a member having recesses in a surface of the member to accommodate die from at least one semiconductor wafer. The member is compatible with semiconductor wafer handling equipment and/or semiconductor wafer processing. Preferably, the member accommodates at least a majority of die from a semiconductor wafer. Further, one semiconductor device assembly method is provided which removes die from a singular waffle pack device, places die from the single waffle pack device on a semiconductor package to assemble from the placed die all die components required for an integrated circuit, and electrically interconnects the placed die in the semiconductor package to form the integrated circuit. Another semiconductor device assembly method is provided which removes die from at least one waffle pack device, places die from the at least one waffle pack device on a semiconductor package to assemble from the placed die device components required for an integrated circuit, and electrically interconnects the placed die in the semiconductor package to form the integrated circuit.

    Abstract translation: 一种华夫饼包装置，包括在所述构件的表面中具有凹部以容纳来自至少一个半导体晶片的模具的构件。 该元件与半导体晶片处理设备和/或半导体晶片处理兼容。 优选地，构件容纳来自半导体晶片的至少大部分管芯。 此外，提供了一种半导体器件组装方法，其从单个华夫饼包装置中去除裸片，将来自单个华夫饼包装置的管芯放置在半导体封装上，以从放置的管芯组装集成电路所需的所有管芯部件，并将 放置在半导体封装中以形成集成电路。 提供了另一种半导体器件组装方法，其从至少一个华夫饼包装置去除管芯，将来自至少一个华夫饼包装置的管芯放置在半导体封装上，以从集成电路所需的放置的管芯器件组件中组装，并将 放置在半导体封装中以形成集成电路。

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