- 专利标题: METHOD AND APPARATUS FOR INDIRECT BONDING OF ORTHODONTIC APPLIANCES
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申请号: PCT/US2004/011689申请日: 2004-04-15
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公开(公告)号: WO2004098440A3公开(公告)日: 2004-11-18
- 发明人: CLEARY, James D., , CINADER, David K., , PUTTLER, Oliver L., , SANKER, John E.,
- 申请人: 3M INNOVATIVE PROPERTIES COMPANY
- 申请人地址: 3M Center, Post Office Box 33427, Saint Paul, MN 55133-3427 US
- 专利权人: 3M INNOVATIVE PROPERTIES COMPANY
- 当前专利权人: 3M INNOVATIVE PROPERTIES COMPANY
- 当前专利权人地址: 3M Center, Post Office Box 33427, Saint Paul, MN 55133-3427 US
- 代理机构: CHRISTOFF, James D.,
- 优先权: US10/428,301 20030502
- 主分类号: A61C7/14
- IPC分类号: A61C7/14
摘要:
An indirect bonding apparatus is made by initially placing spacer material over a replica (20) of the patient's tooth structure. A tray (30) is then formed over the spacer material and hardened. Next, the spacer material is removed from the tooth replica and orthodontic appliances (34) are placed on the replica at desired locations. A matrix material (40) is placed between the tray and the replica and allowed to harden. Optionally, the apparatus includes features for facilitating removal of the transfer apparatus after the bonding procedure has been completed, and features for applying firm, uniform pressure to the appliances during the bonding procedure. Other aspects of indirect bonding are also described.